74AHC3GU04DP,125 NXP Semiconductors, 74AHC3GU04DP,125 Datasheet
74AHC3GU04DP,125
Specifications of 74AHC3GU04DP,125
74AHC3GU04DP-G
935274686125
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74AHC3GU04DP,125 Summary of contents
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Inverter Rev. 04 — 7 January 2010 1. General description The 74AHC3GU04 is a high-speed Si-gate CMOS device. This device provides three inverter gates with unbuffered outputs. 2. Features Symmetrical output impedance High noise immunity ESD protection: HBM JESD22-A114F ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC3GU04DP 74AHC3GU04DC 74AHC3GU04GD 5. Functional diagram mna720 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74AHC3GU04 GND 001aaj517 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74AHC3GU04_4 Product data sheet Marking code AU4 AU4 AU4 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1A, 2A GND 4 1Y, 2Y Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions t propagation nA to nY; see pd delay power per buffer; PD dissipation V = GND capacitance [ the same as t and PLH PHL [2] Typical values are measured [3] Typical values are measured at V ...
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... NXP Semiconductors negative pulse positive pulse Test data is given in Table 10. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 7. Test circuit for measuring switching times Table 10. Test data ...
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... NXP Semiconductors 13. Typical transfer characteristics 2 (V) 1.6 1.2 0.8 0 0.4 0.8 1.2 Fig 2 ( Fig 10 5 74AHC3GU04_4 Product data sheet mna397 1.0 3 (mA) O (V) 0.8 0.6 1.5 0.4 0.2 (drain current 1.6 2.0 V (V) I Fig 9. mna399 (mA (drain current kHz (V) I Fig 11. Test set-up for measuring forward Rev. 04 — ...
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... NXP Semiconductors (mA/V) Fig 12. Typical forward transconductance g 14. Application information Some applications are: • Linear amplifier (see • In crystal oscillator design (see Remark: All values given are typical unless otherwise specified μF R1 U04 − 1.5 V centered at 0.5 × V Maximum o(p- --------------------------------------- ...
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... NXP Semiconductors Table 11. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency 10 kHz to 15.9 kHz 16 kHz to 24.9 kHz 25 kHz to 54.9 kHz 55 kHz to 129.9 kHz 130 kHz to 199.9 kHz 200 kHz to 349.9 kHz 350 kHz to 600 kHz Table 12 ...
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... NXP Semiconductors 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 3.1 mm 0.5 0.00 0.15 2.9 1.9 OUTLINE VERSION IEC SOT996 Fig 17. Package outline SOT996-2 (XSON8U) ...
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... NXP Semiconductors 16. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 14. Revision history Document ID Release date 74AHC3GU04_4 20100107 • Marking code for 74AHC3GU04DP package changed from AU04 to AU4 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 Typical transfer characteristics . . . . . . . . . . . . 7 14 Application information ...