MC74HC365ANG ONSEMI [ON Semiconductor], MC74HC365ANG Datasheet - Page 7

• Manufacturer Part Number: MC74HC365ANG
• Description: Hex 3-State Noninverting Buffer with Common Enables
• Manufacturer: ONSEMI [ON Semiconductor]

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
D
S
S
2X
L/2
C
16
1
0.36
16X
16X
K
−V−
0.10 (0.004)
A
REF
G
M
9
8
SOLDERING FOOTPRINT
PACKAGE DIMENSIONS
1
T
1.26
16X
−U−
U
B
http://onsemi.com
H
S
CASE 948F−01
N
DT SUFFIX
TSSOP−16
V
N
ISSUE B
7.06
J
S
DETAIL E
7
DETAIL E
J1
F
0.25 (0.010)
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
SECTION N−N
M
DIMENSIONS: MILLIMETERS
É É
É É
K1
K
−W−
NOTES:
PITCH
0.65
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.18
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.28
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.007
0.004
0.004
0.007
0.007
MIN
−−−
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.047
0.006
0.030
0.008
0.006
0.012
0.010
0.011
MAX
8
_