SAF7115ET NXP [NXP Semiconductors], SAF7115ET Datasheet
SAF7115ET
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SAF7115ET Summary of contents
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SAF7115 Multistandard video decoder with super-adaptive comb filter, scaler and VBI data read-back via I Rev. 01 — 15 October 2008 1. General description The SAF7115 is a video capture device that, due to its improved comb filter performance and ...
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NXP Semiconductors The SAF7115 incorporates a frame locked audio clock generation. This function ensures that there is always the same number of audio samples associated with a frame set of fields. This prevents the loss of synchronization between ...
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NXP Semiconductors I Independent Brightness Contrast Saturation (BCS) - adjustment for decoder part I User programmable sharpness control I Detection of copy protected input signals: N According to Macrovision standard N Indicating the level of protection I Automatic TV/VCR detection ...
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... Ordering information Table 1. Ordering information Type number Package Name Description SAF7115HW HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 SAF7115ET TFBGA160 plastic thin fine-pitch ball grid array package; 160 balls SAF7115_1 Product data sheet f , 384 f and 512 s s ...
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LLC2 RTS0 XDQ LLC RTC0 RTS1 XCLK XPD[7:0] RT OUT EXPANSION PORT PIN MAPPING AGND AI11 X PORT I/O FORMATTING AI12 AI21 DIGITAL AI22 DECODER ANALOG AI23 WITH DUAL ADAPTIVE AI24 ADC COMB FILTER AOUT AI1D AI2D RESO_N CE PLL2 ...
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... RTS0 38 V SSD(CORE) 42 ITRDY 46 IDQ 50 V SSD(IO) 54 IPD7 58 V DDD(CORE) 62 IPD0 66 HPD5 70 HPD2 74 TEST2 Rev. 01 — 15 October 2008 SAF7115 Multistandard video decoder ball A1 SAF7115ET index area Transparent top view ...
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NXP Semiconductors Table 2. Pin Symbol 77 TEST3 81 XPD7 85 XPD4 89 XPD1 TRST_N [1] See Table 3. Pin Symbol Row XCLK A9 XPD3 A13 TEST4 Row B B1 XTOUT B5 V ...
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NXP Semiconductors Table 3. Pin Symbol H10 V Row J J1 AI21 J6 V J10 V Row K K1 AI12 K6 V K10 V Row L L1 AI11 L6 V L10 TEST8 Row M M1 AOUT Row ...
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NXP Semiconductors Table 4. Pin description …continued Symbol Pin HTQFP100 TFBGA160 Supplies (digital 25, 51 and A1, A14, P1 DDD(IO) 75 and P14 V 33, 43, 58, B5, B10, DDD(CORE) 68, 83 and 93 E13, K13, N5 and ...
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NXP Semiconductors Table 4. Pin description …continued Symbol Pin HTQFP100 TFBGA160 Real time signals RTCO 36 P6 RTS1 35 N6 RTS0 34 P5 Clocks LLC 28 P2 LLC2 29 N3 XTALI 7 D1 XTALO 6 C1 XTOUT 4 B1 Boundary ...
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NXP Semiconductors Table 4. Pin description …continued Symbol Pin HTQFP100 TFBGA160 IGP0 48 P12 IGPH 53 N14 IGPV 52 P13 IPD7 54 M13 IPD6 55 M14 IPD5 56 L13 IPD4 57 L14 IPD3 59 K14 IPD2 60 J13 IPD1 61 ...
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NXP Semiconductors Table 4. Pin description …continued Symbol Pin HTQFP100 TFBGA160 XRDY 96 A4 XRH 92 A6 XRV 91 B6 XTRI 80 A12 Host port (H-port) HPD7 64 G13 HPD6 65 G14 HPD5 66 F13 HPD4 67 F14 HPD3 69 ...
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... To minimize the effective R th(j-a) value is calculated for a 4 layer PCB (100 th(j-a) Rev. 01 — 15 October 2008 Multistandard video decoder Min 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 [1] 0 [2] - [3] - [3] - < 3.6 V. Conditions [1] SAF7115ET [2] SAF7115HW 2 100 mm ) with at least 50 plated through-hole-vias amb(max) SAF7115 Max Unit +4.6 V +4.6 V +4.6 V +4.6 V +4.6 V +4 0.5 V DDx +4.6 V +5.5 ...
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NXP Semiconductors 9. Characteristics Table 7. Characteristics DDD DDA Figure 3 and Figure 4; unless otherwise specified. Symbol Parameter Supplies V analog supply voltage 0 ...
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NXP Semiconductors Table 7. Characteristics …continued DDD DDA Figure 3 and Figure 4; unless otherwise specified. Symbol Parameter G differential gain dif f ADC clock ...
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NXP Semiconductors Table 7. Characteristics …continued DDD DDA Figure 3 and Figure 4; unless otherwise specified. Symbol Parameter Subcarrier PLL f nominal subcarrier subc(nom) frequency ...
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NXP Semiconductors Table 7. Characteristics …continued DDD DDA Figure 3 and Figure 4; unless otherwise specified. Symbol Parameter t rise time r t fall time ...
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NXP Semiconductors clock output XCLK data and control inputs (X port) data and control outputs X port (1) See (2) See Fig 3. X-port input and output timing clock input or output ICLK data and control outputs I port (1) ...
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NXP Semiconductors Table 8. Typical external fundamental crystal characteristics (see Symbol Parameter Crystal oscillator for 32.11 MHz f nominal crystal frequency xtal(nom) f/f nominal crystal frequency xtal(nom) deviation Crystal specification (X1) C load capacitance L R series resistance s C ...
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NXP Semiconductors 10. Application information 10.1 Oscillator applications 10.1.1 Generic oscillator applications Figure 5 input. Table 9 a. Generic oscillator circuit Fig 5. Oscillator applications (see Table 9. Configuration examples quartz crystal (see [1] Example Quartz crystal Type f xtal(nom) ...
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NXP Semiconductors 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Stress test qualification for integrated circuits , and is suitable for use in automotive applications. 11.2 ...
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NXP Semiconductors 11.2.2 Device identification codes A device identification register is specified in IEEE Std. 1149.1b-1994 . 32-bit register which contains fields for the specification of the IC manufacturer, the IC part number and the IC version ...
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NXP Semiconductors 12. Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body mm; exposed die pad y exposed die pad side pin 1 index 100 ...
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NXP Semiconductors TFBGA160: plastic thin fine-pitch ball grid array package; 160 balls ball A1 index area ball ...
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NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction ...
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NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 9. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 13. Acronym ACC ADC AEC AGC BCS CC CCST CGC CGMS CMOS CVBS DC EIA ESD ...
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NXP Semiconductors Table 13. Acronym ITU JTAG LLC LSB MOS MSB MUX NABTS NTSC PAL PCB PLL RT RTC SECAM SMD TAP TTL TV US VBI VCR VGA VITC VPS VTR WSS WST [1] CVBS is also known as “composite ...
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NXP Semiconductors 16. References [1] SAF7115 User Manual ; please contact your local sales office (see 17. Revision history Table 14. Revision history Document ID Release date SAF7115_1 20081015 SAF7115_1 Product data sheet Data sheet status Product data sheet Rev. ...
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NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 20. Index A Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 ...
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NXP Semiconductors Real time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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NXP Semiconductors 21. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .4 Table 2. Pin allocation table (HTQFP100 ...
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NXP Semiconductors 22. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Fig 2. Pin configuration ...
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NXP Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...