SAA7806H NXP [NXP Semiconductors], SAA7806H Datasheet - Page 43
SAA7806H
Manufacturer Part Number
SAA7806H
Description
One chip automotive CD audio device
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SAA7806H.pdf
(73 pages)
- Current page: 43 of 73
- Download datasheet (349Kb)
Philips Semiconductors
9397 750 13697
Objective data sheet
Fig 25. Subcode output; upsampling disabled
Fig 26. Subcode output; upsampling enabled
IISSubo
WCLK
SYNC
IISSubo
WCLK
SYNC
6.6.7.11 Subcode interface
upsample WCLK period)
2
periods (0.5
upsample WCLK
B7 (start)
(start)
S0
B7
Subcode data is output via the IISSubo (pin V4) port. This data can be sampled using the
I
indicates that the serial subcode line IISSubo contains the MSB of a subcode word. It will
be asserted every six WCLK-periods for half a WCLK-period. If a subcode SYNC is
transferred on the subcode line, this signal will be asserted for a full WCLK period.
During normal operation (upsampling disabled), the subcode output via IISSubo will have
the format as shown in
When upsampling is enabled, the I
upsampled rate. The subcode bit period however will stay at the non-upsampled rate as
shown in
times slower relative to the WCLK. In this case the receiver must use the WCLK divided
by four to sample the subcode.
When slave mode is used, without bclk gating, it is also possible to use the IISSubo output
port as a true single-line interface. In that case the receiver needs to sample the data on
the line with a frequency equal to f
per half WCLK). Two characteristics of the interface can be used in this case to
synchronize the bit and byte detection in the stream in the absence of a SYNC signal:
2
S-bus SYNC signal (see
•
non
The first bit (P-bit) of a subcode-byte is used as a start-bit and therefore always ‘1’ (so
no real P-channel information is available on the interface). Between two subcode
bytes there are four zero-bits; this can be used to identify the start of the subcode
bytes within the stream.
B6
B5
Figure
1 subcode byte every 24 I
B4
26. This means that the IISSubo and SYNC signal will appear to be four
(6 x non upsample WCLK periods)
B6
S1
24
B3
upsample WCLK periods
Rev. 01 — 20 June 2005
Figure
B2
Section 6.6.7.9 “I
B1
25.
2
S-bus bytes
WCLK
B0
B5
2
S-bus interface will run at four times the non
2 (since subcode is output at a rate of one bit
2
S-bus interface” on page
One chip automotive CD audio device
(start)
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
B7
B6
B7 (start)
S0
B5
SAA7806
41). The SYNC
001aab769
B4
001aab770
B6
43 of 73
Related parts for SAA7806H
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: