TE28F160B3BD70 Intel Corporation, TE28F160B3BD70 Datasheet

TE28F160B3BD70

Manufacturer Part Number

TE28F160B3BD70

Description

Manufacturer

Intel Corporation

Datasheet

1.TE28F160B3BD70.pdf (71 pages)

Specifications of TE28F160B3BD70

Case

TSOP48

Date_code

06+

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Part Number:

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Company:

Bonase Electronics (HK) Co., Limited

Part Number:

TE28F160B3BD70

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INTEL

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Intel

Memory (B3)

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Product Features

The Intel

and 0.18 µm technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is

available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is

available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about

this product family, see the Intel website: http://www.intel.com/design/flash.

Notice: This specification is subject to change without notice. Verify with your local Intel sales

office that you have the latest datasheet before finalizing a design.

•

— 2.7 V – 3.6 V read/program/erase

— 12 V V

— Reduces overall system power

— 2.7 V – 3.6 V: 70 ns max access time

— Eight 8-KB blocks for data, top or

— Up to 127 x 64-KB blocks for code

— V

— 9 mA typical read current

— V

— –40 °C to +85 °C

— Status registers

Flexible SmartVoltage Technology

1.65 V – .5 V or 2.7 V – 3.6 V I/O option

High Performance

Optimized Block Sizes

Block Locking

Low Power Consumption

Absolute Hardware-Protection

Extended Temperature Operation

Automated Program and Block Erase

bottom locations

WP#

-level control through Write Protect

= GND option

Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13 µm

lockout voltage

Advanced Boot Block Flash

fast production programming

•

—Flash Memory Manager

—System Interrupt Manager

—Supports parameter storage, streaming

—Minimum 100,000 block erase cycles

—Typical I

—48-Ball CSP packages

—40-Lead and 48-Lead TSOP packages

—8-, 16-, 32-, and 64-Mbit densities

—16-Mbit and 32-Mbit densities

—16-, 32-, and 64-Mbit densities

—8-, 16-, and 32-Mbit densities

Intel

Extended Cycling Capability

Automatic Power Savings Feature

Standard Surface Mount Packaging

Density and Footprint Upgradeable for

common package

ETOX™ VIII (0.13 µm) Flash

Technology

ETOX™ VII (0.18 µm) Flash Technology

ETOX ™ VI (0.25µm) Flash Technology

Bo not use the x8 option for new designs

data (for example, voice)

Order Number: 290580, Revision: 020

Flash Data Integrator Software

CCS

after bus inactivity

Datasheet

18 Aug 2005

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