GS88218AB GSI [GSI Technology], GS88218AB Datasheet - Page 30

• Manufacturer Part Number: GS88218AB
• Description: 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
• Manufacturer: GSI [GSI Technology]

JTAG Port Recommended Operating Conditions and DC Characteristics
JTAG Port AC Test Conditions
Notes:
1.
2.
Rev: 1.04 11/2004
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Include scope and jig capacitance.
Test conditions as shown unless otherwise noted.
Input Under/overshoot voltage must be –2 V > Vi < V
V
0 V ≤ V
Output Disable, V
The TDO output driver is served by the V
I
I
I
I
OHJ
OLJ
OHJC
OHJC
ILJ
Output reference level
Input reference level
= + 4 mA
= –4 mA
≤ V
= –100 uA
= +100 uA
Input high level
Input slew rate
Input low level
Parameter
IN
IN
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
≤ V
≤ V
3.3 V Test Port Input High Voltage
2.5 V Test Port Input High Voltage
3.3 V Test Port Input Low Voltage
2.5 V Test Port Input Low Voltage
TDO Output Leakage Current
Test Port Output High Voltage
ILJn
DDn
Test Port Output Low Voltage
Test Port Output CMOS High
Test Port Output CMOS Low
OUT
= 0 to V
Parameter
DDn
DDQ
Conditions
V
supply.
DD
V
V
1 V/ns
0.2 V
DDQ
DDQ
– 0.2 V
/2
/2
DDn
30/38
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
Symbol
V
V
V
V
V
V
V
I
V
I
I
INHJ
OHJC
INLJ
OLJC
OLJ
IHJ3
IHJ2
ILJ3
ILJ2
OHJ
OLJ
GS88218/36AB/D-250/225/200/166/150/133
V
DDQ
DQ
0.6 * V
Min.
–300
–0.3
–0.3
– 100 mV
2.0
1.7
–1
–1
—
—
DD2
* Distributed Test Jig Capacitance
JTAG Port AC Test Load
0.3 * V
V
V
V
100 mV
DD3
DD2
Max.
DDQ
100
0.8
0.4
—
—
1
1
+0.3
+0.3
/2
DD2
50Ω
© 2001, GSI Technology
Unit Notes
uA
uA
uA
V
V
V
V
V
V
V
V
30pF
*
5, 6
5, 7
5, 8
5, 9
1
1
1
1
2
3
4