EX256-CS100 ACTEL [Actel Corporation], EX256-CS100 Datasheet - Page 20

• Manufacturer Part Number: EX256-CS100
• Description: eX Automotive Family FPGAs
• Manufacturer: ACTEL [Actel Corporation]

Package Thermal Characteristics
The device junction-to-case thermal characteristic is θ
and the junction-to-ambient air characteristic is θ
thermal characteristics for θ
different air flow rates. θ
The maximum junction temperature is 150°C.
Table 1-12 • Package Thermal Characteristics
1 -1 6
Package Type
Thin Quad Flat Pack
Thin Quad Flat Pack
Chip-Scale Package
Chip-Scale Package
Chip-Scale Package
eX Automotive Family FPGAs
Maximum Power Allowed
jc
is provided for reference.
ja
=
are shown with two
Max. junction temp. (°C) Max. ambient temp. (°C)
---------------------------------------------------------------------------------------------------------------------------------
Pin Count
100
128
180
64
49
ja
. The
θ
ja
(°C/W)
jc
,
–
v3.2
12.0
14.0
The maximum power dissipation allowed for eX devices
is a function of θ
maximum power dissipation allowed for a TQFP 100-pin
package at automotive temperature and still air is as
follows:
θ
jc
Still Air
42.4
33.5
72.2
54.1
57.8
ja
=
. A sample calculation of the absolute
150°C 125°C
------------------------------------- -
θ
ja
33.5°C/W
1.0 m/s
36.3
27.4
59.5
44.6
47.6
θ
ja
–
=
θ
ja
0.746 W
2.5 m/s
34.0
25.0
54.1
40.6
43.3
Units
°C/W
°C/W
°C/W
°C/W
°C/W