EX256-CS100 ACTEL [Actel Corporation], EX256-CS100 Datasheet - Page 28

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EX256-CS100

Manufacturer Part Number
EX256-CS100
Description
eX Automotive Family FPGAs
Manufacturer
ACTEL [Actel Corporation]
Datasheet
Pin Description
CLKA/B
These pins are clock inputs for clock distribution
networks. Input levels are compatible with LVTTL and
LVCMOS specifications. The clock input is buffered prior
to clocking the R-cells. If not used, this pin must be set
Low or High on the board. It must not be left floating.
GND
Low supply voltage.
HCLK
This pin is the clock input for sequential modules. Input
levels
specifications. This input is directly wired to each R-cell and
offers clock speeds independent of the number of R-cells
being driven. If not used, this pin must be set Low or High
on the board. It must not be left floating.
I/O
The I/O pin functions as an input, output, tristate, or
bidirectional
compatible with LVTTL and LVCMOS specifications.
Unused I/O pins are automatically tristated by the
Designer software. It is recommended to tie unused I/Os
to Low on the board. This also applies to dual-purpose
pins when configured as I/Os.
NC
This pin is not connected to circuitry within the device.
These pins can be driven to any voltage or can be left
floating with no effect on the operation of the device.
PRA/PRB, I/O
The Probe pin is used to output data from any user-
defined design node within the device. This diagnostic
pin can be used independently or in conjunction with the
other probe pin to allow real-time diagnostic output of
any signal path within the device. The Probe pin can be
employed as a user-defined I/O when verification has
been completed. The pin’s probe capabilities can be
permanently disabled to protect programmed design
confidentiality.
TCK, I/O
Test clock input for diagnostic probe and device
programming. In flexible mode, TCK becomes active
when the TMS pin is set Low (refer to
page
boundary scan state machine reaches the “logic reset”
state.
1 -2 4
eX Automotive Family FPGAs
1-8). This pin functions as an I/O when the
are
compatible
buffer.
Routed Clock A and B
Ground
Dedicated (Hardwired)
Array Clock
Input/Output
No Connection
Probe A/B
Test Clock
Input
with
and
LVTTL
output
and
Table 1-3 on
levels
LVCMOS
are
v3.2
TDI, I/O
Serial input for boundary scan testing and diagnostic
probe. In flexible mode, TDI is active when the TMS pin is
set Low (refer to
functions as an I/O when the boundary scan state
machine reaches the “logic reset” state.
TDO, I/O
Serial output for boundary scan testing. In flexible mode,
TDO is active when the TMS pin is set Low (refer to
Table 1-3 on page
the boundary scan state machine reaches the "logic
reset" state. When Silicon Explorer is being used, TDO
will act as an output when the "checksum" command is
run. It will return to a user I/O when "checksum" is
complete.
TMS
The TMS pin controls the use of the IEEE 1149.1
boundary scan pins (TCK, TDI, TDO, TRST). In flexible
mode, when the TMS pin is set Low, the TCK, TDI, and
TDO pins are boundary scan pins (refer to
page
they will remain in that mode until the internal
boundary scan state machine reaches the “logic reset”
state. At this point, the boundary scan pins will be
released and will function as regular I/O pins. The “logic
reset” state is reached five TCK cycles after the TMS pin is
set High. In dedicated test mode, TMS functions as
specified in the IEEE 1149.1 specifications.
TRST, I/O
Once it is configured as the JTAG Reset pin, the TRST pin
functions as an active-low input to asynchronously
initialize or reset the boundary scan circuit. The TRST pin
is equipped with an internal pull-up resistor. This pin
functions as an I/O when the “Reserve JTAG Reset Pin” is
not selected in the Designer software.
V
Supply voltage for I/Os.
V
Supply voltage for Array.
CCI
CCA
1-8). Once the boundary scan pins are in test mode,
Test Data Input
Test Data Output
Test Mode Select
Boundary Scan Reset Pin
Supply Voltage
Supply Voltage
1-8). This pin functions as an I/O when
Table 1-3 on page
1-8). This pin
Table 1-3 on

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