C8051F966-A-GQ Silicon Labs, C8051F966-A-GQ Datasheet - Page 3

• Manufacturer Part Number: C8051F966-A-GQ
• Description: 8-bit Microcontrollers - MCU 32KB DC-DC LCD AES
• Manufacturer: Silicon Labs

Specifications of C8051F966-A-GQ

• Rohs: yes
• Core: 8051
• Processor Series: C8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 24.5 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.8 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: QFP-80
• Mounting Style: SMD/SMT

Table of Contents
1. System Overview ..................................................................................................... 23
2. Ordering Information ............................................................................................... 35
3. Pinout and Package Definitions ............................................................................. 36
4. Electrical Characteristics ........................................................................................ 56
5. SAR ADC with 16-bit Auto-Averaging Accumulator and Autonomous Low Power
Burst Mode ................................................................................................................... 78
1.1. CIP-51™ Microcontroller Core .......................................................................... 29
1.2. Port Input/Output ............................................................................................... 30
1.3. Serial Ports ........................................................................................................ 31
1.4. Programmable Counter Array............................................................................ 31
1.5. SAR ADC with 16-bit Auto-Averaging Accumulator and 
1.6. Programmable Current Reference (IREF0)....................................................... 33
1.7. Comparators...................................................................................................... 33
3.1. DQFN-76 Package Specifications ..................................................................... 46
3.2. QFN-40 Package Specifications........................................................................ 50
3.3. TQFP-80 Package Specifications...................................................................... 52
4.1. Absolute Maximum Specifications..................................................................... 56
4.2. Electrical Characteristics ................................................................................... 57
5.1. Output Code Formatting .................................................................................... 78
5.2. Modes of Operation ........................................................................................... 80
5.3. 8-Bit Mode ......................................................................................................... 84
5.4. 12-Bit Mode ....................................................................................................... 84
5.5. Low Power Mode............................................................................................... 85
5.6. Programmable Window Detector....................................................................... 91
5.7. ADC0 Analog Multiplexer .................................................................................. 95
5.8. Temperature Sensor.......................................................................................... 97
5.9. Voltage and Ground Reference Options ......................................................... 100
1.1.1. Fully 8051 Compatible .............................................................................. 29
1.1.2. Improved Throughput................................................................................ 29
1.1.3. Additional Features ................................................................................... 29
3.1.1. Package Drawing ...................................................................................... 46
3.1.2. Land Pattern.............................................................................................. 47
3.1.3. Soldering Guidelines ................................................................................. 48
3.3.1. Soldering Guidelines ................................................................................. 55
5.2.1. Starting a Conversion................................................................................ 80
5.2.2. Tracking Modes......................................................................................... 80
5.2.3. Burst Mode................................................................................................ 82
5.2.4. Settling Time Requirements...................................................................... 83
5.2.5. Gain Setting .............................................................................................. 83
5.6.1. Window Detector In Single-Ended Mode .................................................. 93
5.6.2. ADC0 Specifications ................................................................................. 94
5.8.1. Calibration ................................................................................................. 97
Autonomous Low Power Burst Mode ................................................................ 32
Rev. 0.5
C8051F96x
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