iCE40HX8K-CT256 Lattice, iCE40HX8K-CT256 Datasheet - Page 8

• Manufacturer Part Number: iCE40HX8K-CT256
• Description: FPGA - Field Programmable Gate Array iCE40HX 7680 LUTs, 1.2V Ultra Low-Power
• Manufacturer: Lattice

Specifications of iCE40HX8K-CT256

• Rohs: yes
• Number Of Gates: 7680
• Number Of Logic Blocks: 32
• Number Of I/os: 206
• Maximum Operating Frequency: 533 MHz
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: BGA-256
• Distributed Ram: 128 Kbit
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 119

iCE40 HX-Series Ultra-Low Power mobileFPGA
Lattice Semiconductor Corporation
www.latticesemi.com/
Write Setup/Hold Time
t
t
Read Clock-Output-Time
t
t
Write and Read Clock Characteristics
t
t
t
F
SUWD
HDWD
CKORD
GBCKRM
RMWCKH
RMWCKL
RMWCYC
RAM4K Block
WMAX
Table 10
input
GBIN
input
RCLK
input
GBIN
input
WCLK
clock
RCLK
provides timing information for the logic in a RAM4K block, which includes the paths shown in
PIO
output
GBIN
RCLK
WCLK
input
input
clock
input
RCLK
PIO
PIO
GBIN
PAD
Minimum write data setup time on PIO inputs before active clock
edge on GBIN input, include interconnect delay.
Minimum write data hold time on PIO inputs after active clock edge
on GBIN input, including interconnect delay.
Clock-to-output delay from RCLK input pin, through RAM4K RDATA
output flip-flop to PIO output pad, including interconnect delay.
Global Buffer Input (GBIN) delay, though Global Buffer (GBUF)
clock network to the RCLK clock input.
Write clock High time
Write clock Low time
Write clock cycle time
Sustained write clock frequency
GBUF
PIO
Table 10:
WDATA
WCLK
Figure 9:
Typical RAM4K Block Timing
Description
RAM4K Timing Circuit
RAM Block
(256x16)
RAM4K
™
RDATA
Family
RCLK
Nominal VCC
GBUF
PIO
GBIN
PAD
(1.31, 30-MAR-2012)
1.2 V
Typ.
0.44
0.30
0.35
0.71
256
4.1
1.4
0
Figure
MHz
ns
ns
ns
ns
ns
ns
ns
9.
8