PCA9517ATP,147 NXP Semiconductors, PCA9517ATP,147 Datasheet - Page 17

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PCA9517ATP,147

Manufacturer Part Number
PCA9517ATP,147
Description
Interface - Signal Buffers, Repeaters LVL XLATE 5.5V 2CHAN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9517ATP,147

Rohs
yes
Package / Case
HWSON-8
Power Dissipation
100 mW
Factory Pack Quantity
4000
NXP Semiconductors
PCA9517A
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
8
18.
Rev. 4 — 9 May 2012
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
18) than a SnPb process, thus
Level translating I
≥ 350
220
220
PCA9517A
> 2000
260
245
245
© NXP B.V. 2012. All rights reserved.
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C-bus repeater
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