M25P80-VMW6 STMicroelectronics, M25P80-VMW6 Datasheet - Page 50

• Manufacturer Part Number: M25P80-VMW6
• Description: IC FLASH 8MBIT 40MHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M25P80-VMW6

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 40MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-3601

Revision history
13
50/52
Revision history
Table 21.
07-May-2004
18-May-2004
27-Sep-2002
13-Dec-2002
24-Nov-2003
05-Aug-2004
01-Aug-2005
24-Apr-2002
24-Oct-2003
21-Apr-2004
20-Oct-2005
13-Apr-2006
20-Jul-2006
Date
Document revision history
Revision
1.0
1.1
1.2
2.0
2.1
3.0
4.0
5.0
6.0
7.0
8.0
10
9
Document released as a Product Preview data sheet
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-out
sequence.
VFQFPN8 package (MLP8) added. Order code (MW) corrected on page 1
for SO8 package. Document promoted to Preliminary Data.
Typical Page Program time improved. Write Protect setup and hold times
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
40MHz AC Characteristics table included as well as 25MHz. Change of
naming for VDFPN8 package. Document promoted to full datasheet
Improvement to description of reading the 8-bit electronic signature.
SO16 package added. SO8W package removed. Soldering temperature
information clarified for RoHS compliant devices. Device Grade clarified
Automotive range added
SO8W package re-instated, but under limited availability
Data-retention measurement temperature corrected. Details of how to find
the date of marking added.
Updated Page Program (PP) instructions in
Program
SO16 package removed. All packages are ECOPACK®. MLP8 package
renamed as VFQFPN8. Plating technology clarified in
information
1). t
Device grade 3 specifications removed from datasheet. Data retention
conditions changed in
Figure 3: Bus Master and memory devices on the SPI bus
Note 2
Note 2
Note on SO8 package removed below
scheme.
SO8N package added (see
SHQZ
added.
added below
(PP),
timing modified in
scheme. VFQFPN silhouette modified (see silhouette
Instruction times
Figure 26
Table 11: Data retention and
Figure 25: Output
Figure 28
and
Changes
and
Note 2
Instruction Times (Device Grade
and
Table 20: Ordering information
Table
added below
Page
timing.
19).
Programming,
endurance.
Table 20: Ordering
Figure
modified and
27.
Page
on page
M25P80
3).