W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 39

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 208-mil (Winbond Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
A1
A2
E1
C
D
A
E
b
e
L
θ
y
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
- 39 -
o
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
W25P80 AND W25P16
MIN
---
0
Publication Release Date: January 19, 2007
0.050 BSC
o
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o
Revision M