MD2533-D8G-X-P SanDisk, MD2533-D8G-X-P Datasheet - Page 8

• Manufacturer Part Number: MD2533-D8G-X-P
• Description: IC MDOC H3 8GB FBGA
• Manufacturer: SanDisk

Specifications of MD2533-D8G-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 8G (1G x 8)
• Interface: Parallel
• Voltage - Supply: 1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 115-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -

9. Design Considerations ...........................................................................................................55
10. Product Specifications............................................................................................................66
8
8.1
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10 Platform-Specific Issues ...................................................................................................63
9.11 Design Environment .........................................................................................................65
10.1 Environmental Specifications............................................................................................66
10.2 Electrical Specifications ....................................................................................................66
10.3 Timing Specifications........................................................................................................71
Introduction .......................................................................................................................52
8.1.1
8.1.2
8.1.3
General Guidelines ...........................................................................................................55
Configuration and GPIO Interface ....................................................................................55
Standard NOR-Like Interface ...........................................................................................56
Multiplexed Interface.........................................................................................................57
H3 Power Supply Connectivity .........................................................................................58
Connecting Control Signals ..............................................................................................58
9.6.1
9.6.2
Implementing the Interrupt Mechanism ............................................................................59
9.7.1
9.7.2
DMA and Burst Operation.................................................................................................60
9.8.1
9.8.2
Device Cascading.............................................................................................................62
9.10.1 Wait State............................................................................................................................63
9.10.2 Big and Little Endian Systems ............................................................................................63
9.10.3 Busy Signal .........................................................................................................................63
9.10.4 Working with 16/32-Bit Systems .........................................................................................64
10.1.1 Operating Temperature.......................................................................................................66
10.1.2 Thermal Characteristics ......................................................................................................66
10.1.3 Humidity ..............................................................................................................................66
10.2.1 Absolute Maximum Ratings ................................................................................................66
10.2.2 Capacitance ........................................................................................................................66
10.2.3 DC Characteristics ..............................................................................................................67
10.2.4 Operating Conditions ..........................................................................................................69
Asynchronous Boot Mode ...................................................................................................53
Virtual RAM Boot.................................................................................................................53
Paged RAM Boot ................................................................................................................54
Standard Interface...............................................................................................................58
Multiplexed Interface ...........................................................................................................59
Hardware Configuration ......................................................................................................59
Software Configuration........................................................................................................59
DMA Operation ...................................................................................................................60
Burst Operation ...................................................................................................................61
Data Sheet (Preliminary) Rev. 0.2
mDOC H3 Embedded Flash Drive
92-DS-1205-10