ISL6256HAZ Intersil, ISL6256HAZ Datasheet - Page 19

IC BATTERY CHARGER CTRLR 28-QSOP

ISL6256HAZ

Manufacturer Part Number
ISL6256HAZ
Description
IC BATTERY CHARGER CTRLR 28-QSOP
Manufacturer
Intersil
Datasheet

Specifications of ISL6256HAZ

Function
Charge Management
Battery Type
Lithium-Ion (Li-Ion), Lithium-Polymer (Li-Pol)
Voltage - Supply
7 V ~ 25 V
Operating Temperature
-10°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
28-SSOP (0.150", 3.95mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
• I
Low switching loss requires low drain-to-gate charge Q
Generally, the lower the drain-to-gate charge, the higher the
ON-resistance. Therefore, there is a trade-off between the
ON-resistance and drain-to-gate charge. Good MOSFET
selection is based on the figure of Merit (FOM), which is a
product of the total gate charge and ON-resistance. Usually,
the smaller the value of FOM, the higher the efficiency for
the same application.
For the low-side MOSFET, the worst-case power dissipation
occurs at minimum battery voltage and maximum input
voltage (Equation 26):
Choose a low-side MOSFET that has the lowest possible
ON-resistance with a moderate-sized package like the SO-8
and is reasonably priced. The switching losses are not an
issue for the low-side MOSFET because it operates at
zero-voltage-switching.
Choose a Schottky diode in parallel with low-side MOSFET
Q
low-side MOSFET Q
dead time. This also reduces the power loss in the high-side
MOSFET associated with the reverse recovery of the
low-side MOSFET Q
As a general rule, select a diode with DC current rating equal
to one-third of the load current. One option is to choose a
combined MOSFET with the Schottky diode in a single
package. The integrated packages may work better in
practice because there is less stray inductance due to a
short connection. This Schottky diode is optional and may be
removed if efficiency loss can be tolerated. In addition,
ensure that the required total gate drive current for the
selected MOSFETs should be less than 24mA. So, the total
gate charge for the high-side and low-side MOSFETs is
limited by Equation 27:
Where I
less than 24mA. Substituting I
into Equation 27 yields that the total gate charge should be
less than 80nC. Therefore, the ISL6256 easily drives the
battery charge current up to 10A.
Snubber Design
ISL6256's buck regulator operates in discontinuous current
mode (DCM) when the load current is less than half the
peak-to-peak current in the inductor. After the low-side FET
turns off, the phase voltage rings due to the high impedance
with both FETs off. This can be seen in Figure 9. Adding a
snubber (resistor in series with a capacitor) from the phase
node to ground can greatly reduce the ringing. In some
P
Q
Q2
2
GATE
g
with a forward voltage drop low enough to prevent the
,
source
=
GATE
1
1
------------------ -
GATE
f
V
--------------- -
sw
V
OUT
IN
is the total gate drive current and should be
I
BAT
2
2
body-diode from turning on during the
body diode.
2
r
DS ON
19
GATE
(
)
= 24mA and f
s
= 300kHz
ISL6256, ISL6256A
(EQ. 26)
(EQ. 27)
gd
.
situations a snubber can improve output ripple and
regulation.
The snubber capacitor should be approximately twice the
parasitic capacitance on the phase node. This can be
estimated by operating at very low load current (100mA) and
measuring the ringing frequency.
CSNUB and RSNUB can be calculated from Equations 28
and 29:
Input Capacitor Selection
The input capacitor absorbs the ripple current from the
synchronous buck converter, which is given by Equation 30:
This RMS ripple current must be smaller than the rated RMS
current in the capacitor datasheet. Non-tantalum chemistries
(ceramic, aluminum, or OSCON) are preferred due to their
resistance to power-up surge currents when the AC adapter
is plugged into the battery charger. For Notebook battery
charger applications, it is recommended that ceramic
capacitors or polymer capacitors from Sanyo be used due to
their small size and reasonable cost.
Table 2 shows the component lists for the typical application
circuit in Figure 2.
R
C
I
RMS
C
C
SNUB
SNUB
C
PARTS
2
3
Q
Q
, C
, C
1
C
1
3
C
C
D
D
Q
Q
, C
L
, Q
, Q
11
=
4
7
5
6
1
2
5
6
, C
, C
10
=
=
I
2
4
BAT
8
9
------------------------------------ -
(
2πF
------------------- -
C
------------------------------------------------------------ -
2 L
SNUB
10µF/25V ceramic capacitor, Taiyo Yuden
TMK325 MJ106MY X5R (3.2mmx2.5mmx1.9mm)
0.1µF/50V ceramic capacitor
1µF/10V ceramic capacitor, Taiyo Yuden
LMK212BJ105MG
10nF ceramic capacitor
6.8nF ceramic capacitor
3300pF ceramic capacitor
30V/3A Schottky diode, EC31QS03L (optional)
100mA/30V Schottky Diode, Central Semiconductor
10µH/3.8A/26mΩ, Sumida, CDRH104R-100
30V/35mΩ, FDS6912A, Fairchild
-30V/30mΩ, SI4835BDY, Siliconix
Signal P-Channel MOSFET, NDS352AP
Signal N-Channel MOSFET, 2N7002
V
ring
OUT
TABLE 2. COMPONENT LIST
2
PART NUMBERS AND MANUFACTURER
)
2
(
V
L
V
IN
IN
V
OUT
)
September 14, 2010
(EQ. 28)
(EQ. 29)
(EQ. 30)
FN6499.3

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