IC DRIVER FULL BRIDGE DUAL 24DIP

L6227N

Manufacturer Part NumberL6227N
DescriptionIC DRIVER FULL BRIDGE DUAL 24DIP
ManufacturerSTMicroelectronics
TypeH Bridge
L6227N datasheet
 


Specifications of L6227N

Input TypeNon-InvertingNumber Of Outputs4
On-state Resistance730 mOhmCurrent - Output / Channel1.4A
Current - Peak Output2.8AVoltage - Supply8 V ~ 52 V
Operating Temperature-25°C ~ 125°CMounting TypeThrough Hole
Package / CasePowerSSO-24Operating Supply Voltage8 V to 52 V
Supply Current1.4 AMounting StyleThrough Hole
For Use With497-6817 - EVAL BOARD FOR L6227QLead Free Status / RoHS StatusLead free / RoHS Compliant
Other names497-3648  
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OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Fig. 17 and Fig. 18 are shown the approximate relation between the output current and the IC power dissipa-
tion using PWM current control driving two loads, for two different driving types:
– One Full Bridge ON at a time (Fig.17) in which only one load at a time is energized.
– Two Full Bridges ON at the same time (Fig.18) in which two loads at the same time are energized.
For a given output current and driving type the power dissipated by the IC can be easily evaluated, in order to
establish which package should be used and how large must be the on-board copper dissipating area to guar-
antee a safe operating junction temperature (125°C maximum).
Figure 17. IC Power Dissipation versus Output Current with One Full Bridge ON at a time.
ONE FULL BRIDGE ON AT A TIME
10
8
6
P
[W]
D
4
2
0
0
0.25 0.5 0.75 1
Figure 18. IC Power Dissipation versus Output Current with Two Full Bridges ON at the same time.
TWO FULL BRIDGES ON AT THE SAME TIME
10
8
6
P
[W ]
D
4
2
0
0
0.25 0.5 0.75 1
THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can be de-
livered by the device in a safe operating condition. Therefore, it has to be taken into account very carefully. Besides
the available space on the PCB, the right package should be chosen considering the power dissipation. Heat sinking
can be achieved using copper on the PCB with proper area and thickness. Figures 20, 21 and 22 show the Junction-
to-Ambient Thermal Resistance values for the PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper thickness FR4 board
2
with 6cm
dissipating footprint (copper thickness of 35µm), the R
ing methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance can be
reduced down to 15°C/W.
I
A
I
B
1.25 1.5
I
[A]
OUT
I
A
I
B
1.25 1.5
I
[A ]
OUT
th j-amb
I
OUT
I
OUT
Test Conditions:
Supply Voltage = 24V
No PW M
f
= 3 0 kHz (slow decay)
SW
I
OUT
I
OUT
Test Conditions:
Supply Volt age = 24 V
No PWM
f
= 30 kHz (slow decay)
SW
is about 35°C/W. Fig. 19 shows mount-
L6227
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