VND830-E STMicroelectronics, VND830-E Datasheet - Page 9

no-image

VND830-E

Manufacturer Part Number
VND830-E
Description
IC DRIVER HIGH SIDE 2CH 16-SOIC
Manufacturer
STMicroelectronics
Type
High Sider
Datasheet

Specifications of VND830-E

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
60 mOhm
Current - Peak Output
9A
Voltage - Supply
5.5 V ~ 36 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Device Type
High Side
Module Configuration
High Side
Peak Output Current
9A
Output Resistance
0.06ohm
Input Delay
30µs
Output Delay
30µs
Supply Voltage Range
5.5V To 36V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output / Channel
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VND830-E
Manufacturer:
ST
0
Figure 7. Application Schematic
GND
REVERSE BATTERY
Solution 1: Resistor in the ground line (R
can be used with any type of load.
The following is an indication on how to dimension the
R
where -I
be found in the absolute maximum rating section of the of
the device’s datasheet.
Power Dissipation in R
battery situations) is:
P
This resistor can be shared amongst several different
HSD. Please note that the value of this resistor should be
calculated with formula (1) where I
sum of the maximum on-state currents of the different
devices.
Please note that if the microprocessor ground is not
common with the device ground then the R
produce a shift (I
and the status output values. This shift will vary
depending on many devices are ON in the case of several
high side drivers sharing the same R
D
GND
1) R
2) R
= (-V
resistor.
GND
GND
CC
GND
+5V
PROTECTION
µC
)
≤ 600mV / I
≥ (−V
2
/R
is the DC reverse ground pin current and can
GND
CC
S(on)max
) / (-I
R
R
R
R
prot
prot
prot
prot
S(on)max
GND
GND
* R
+5V
)
(when V
NETWORK
GND
.
+5V
) in the input thresholds
S(on)max
CC
GND
<0: during reverse
STATUS2
INPUT2
STATUS1
INPUT1
.
GND
becomes the
AGAINST
only). This
GND
will
V
GND
If the calculated power dissipation leads to a large
resistor or several devices have to share the same
resistor then the ST suggest to utilize Solution 2 (see
below).
Solution 2: A diode (D
A resistor (R
D
This small signal diode can be safely shared amongst
several different HSD. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the
input threshold and the status output values if the
microprocessor ground is not common with the device
ground. This shift will not vary if more than one HSD
shares the same diode/resistor network.
Series resistor in INPUT and STATUS lines are also
required to prevent that, during battery voltage transient,
the current exceeds the Absolute Maximum Rating.
Safest configuration for unused INPUT and STATUS pin
is to leave them unconnected.
LOAD DUMP PROTECTION
D
load dump peak voltage exceeds V
The same applies if the device will be subject to
transients on the V
shown in the ISO T/R 7637/1 table.
GND
ld
R
GND
GND
is necessary (Voltage Transient Suppressor) if the
if the device will be driving an inductive load.
V
CC
GND
D
GND
=1kΩ) should be inserted in parallel to
CC
OUTPUT2
GND
line that are greater than the ones
OUTPUT1
) in the ground line.
CC
max DC rating.
VND830-E
D
ld
9/20

Related parts for VND830-E