MC33887AVW Freescale Semiconductor, MC33887AVW Datasheet - Page 34

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MC33887AVW

Manufacturer Part Number
MC33887AVW
Description
IC H-BRIDGE LOAD CURR FB 20-HSOP
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC33887AVW

Applications
DC Motor Controller, H Bridge
Number Of Outputs
1
Current - Output
5A
Voltage - Supply
5 V ~ 28 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-HSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Load
-

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Device on Thermal Test Board
34
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
AGND
PGND
PGND
OUT1
OUT1
IN1
FS
V+
V+
FB
12.2 mm x 6.9 mm Exposed Pad
33887 Pin Connections
1
2
3
4
5
6
7
8
9
10
16.0 mm x 11.0 mm Body
20-Pin HSOP-EP
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat spreading areas on board
surface
Natural convection, still air
1.27 mm Pitch
Tab
Tab
20
19
18
17
16
15
14
13
12
11
EN
IN2
D1
C
V+
OUT2
OUT2
D2
PGND
PGND
Figure 26. Thermal Test Board
CP
Table 8.
ambient air.
reference location on the board surface near a center lead of the
package (see
Thermal Resistance
R
R
θ
θ
JA
JS
is the thermal resistance between die junction and
is the thermal resistance between die junction and the
R
R
θ
θ
JA
JS
Thermal Resistance Performance
Figure
A
26).
Analog Integrated Circuit Device Data
Area A (mm
300
600
300
600
0.0
0.0
Freescale Semiconductor
2
)
°C/W
7.0
6.0
52
36
32
10

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