L6710 STMicroelectronics, L6710 Datasheet - Page 4

• Manufacturer Part Number: L6710
• Description: IC CTRLR 6BIT 2PH PROGR 44-TQFP
• Manufacturer: STMicroelectronics
• Type: Step-Down (Buck)r

Specifications of L6710

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.84 ~ 1.6 V
• Current - Output: 2A
• Frequency - Switching: 150kHz
• Voltage - Input: 12V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP, 44-VQFP
• Power - Output: 2.5W
• Product: Half-Bridge Drivers
• Supply Current: 12.5 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

L6710
PIN FUNCTION (continued)
4/34
24 to 29
32 to 34
PAD
22
23
30
31
35
36
37
38
39
40
41
42
43
44
N
OSC/FAULT
THERMAL
PHASE2
PHASE1
HGATE2
HGATE1
PGOOD
LGATE2
LGATE1
VCCDR
BOOT2
VID0-5
PGND
Name
N.C.
N.C.
N.C.
N.C.
PAD
Oscillator pin.
It allows programming the switching frequency of each channel: the equivalent switching
frequency at the load side results in being doubled.
Internally fixed at 1.24V, the frequency is varied proportionally to the current sunk (forced)
from (into) the pin with an internal gain of 6kHz/µA (See relevant section for details). If the
pin is not connected, the switching frequency is 150kHz for each channel (300kHz on the
load).
The pin is forced high (5V Typ.) when an Over/Under Voltage is detected; to recover from
these latched conditions, cycle VCC.
Not internally bonded.
Voltage IDentification pins.
Internally pulled-up, connect to SGND to program a ‘0’ while leave floating to program a ‘1’.
They are used to program the output voltage as specified in Table 1 and to set the PGOOD,
OVP and UVP thresholds.
Since the VID pins program the maximum output voltage, according to VRD10 specs, the
device automatically regulates to a voltage VID* = VID–25mV avoiding use of any external
component to lower the regulated voltage.
This pin is an open collector output and is pulled low if the output voltage is not within the
above-specified thresholds and during soft-start. It cannot be pulled up above 3.3V
If not used may be left floating.
Channel 2 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF typ.) to the PHASE2 pin and through a diode to VCC
(cathode vs. boot).
Not internally bonded.
Channel 2 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and
provides the return path for the HS driver of channel 2.
Not internally bonded.
Channel 2 LS driver output.
A little series resistor helps in reducing device-dissipated power.
LS drivers return path.
This pin is common to both sections and it must be connected through the closest path to
the LS mosfets source pins in order to reduce the noise injection into the device.
Channel 1 LS driver output.
A little series resistor helps in reducing device-dissipated power.
Filter locally with at least 1µF ceramic cap vs. PGND.
Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and
provides the return path for the HS driver of channel 1.
Channel 1 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Not internally bonded.
Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB
to dissipate the power necessary to drive external mosfets. Connect to the GND plane with
several vias to improve thermal conduction.
LS drivers supply: it can be varied from 5V to 12V buses.
Description