# IDT89HPES16T7ZHBX

Manufacturer Part NumberIDT89HPES16T7ZHBX
DescriptionIC PCI SW 16LANE 7PORT 320-SBGA
ManufacturerIDT, Integrated Device Technology Inc
IDT89HPES16T7ZHBX datasheet

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## Specifications of IDT89HPES16T7ZHBX

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IDT 89HPES16T7 Data Sheet
Heat Sink
Table 17 lists heat sink requirements for the PES16T7 under two common usage scenarios. As shown in this table, a heat sink is not required in
most cases.
Air Flow
Zero
3.9”x6.2” (ExpressModule form factor) or larger
1 m/S or more
Table 17 Heat Sink Requirements Based on Air Flow and Board Characteristics
Thermal Usage Examples
The junction-to-ambient thermal resistance is a measure of a device’s ability to dissipate heat from the die to its surroundings in the absence of a
heat sink. The general formula to determine
θ
= (T
- T
)/P
JA
J
A
Thermal reliability of a device is generally assured when the actual value of T
maximum T
specified for the device. Using an ambient temperature of 70
J
θ
T
= T
+ P *
= 70
J(actual)
A
JA(eff)
o
The actual T
of 106
C is well below the maximum T
J
this scenario. The formula is also useful from a system design perspective. It can be used to determine if a heat sink should be added to the device
based on some desired value of T
. For example, if for reliability purposes the desired T
J
T
= T
- (P *
A(allowed)
J(desired)
o
T
= 100
C - (3.6W * 10.1W/
A(allowed)
ssdhelp@idt.com for further assistance.
Board Size
Any
θ
is:
JA
J
o
C and assuming a system with 1m/S airflow, the actual value of T
o
o
o
C + 3.6W * 10.1W/
C = 106
C
o
of 125
C specified for the device (shown in Table 16). Therefore, no heat sink is needed in
J
θ
)
JA(effective)
o
o
o
o
C) = 100
C - 36
C = 64
C
17 of 33
Board Layers
Heat Sink Requirement
10 or more
No heat sink required
Any
No heat sink required
in the specific system environment being considered is less than the
o
is 100
C, then the maximum allowable T
J
is:
J
is:
A
March 25, 2008