HCPL-0738-500 Avago Technologies US Inc., HCPL-0738-500 Datasheet - Page 3

• Manufacturer Part Number: HCPL-0738-500
• Description: OPTOCOUPLER 15MBD 2CH 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0738-500

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 2mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 35ns @ 12mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 2 mA
• Maximum Fall Time: 25 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 20 ns
• Minimum Forward Diode Voltage: 1.3 V
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Recommended Pb-Free IR Profile
Solder Reflow Temperature Profile
3
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
Note: Non-halide flux should be used.
T
smax
Note: Non-halide flux should be used.
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250