HCPL-0738-500 Avago Technologies US Inc., HCPL-0738-500 Datasheet - Page 4

• Manufacturer Part Number: HCPL-0738-500
• Description: OPTOCOUPLER 15MBD 2CH 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0738-500

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 2mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 35ns @ 12mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 2 mA
• Maximum Fall Time: 25 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 20 ns
• Minimum Forward Diode Voltage: 1.3 V
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
Insulation and Safety Related Specifications (approval pending)
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Output Voltage
Average Forward Input Current
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)

All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
Symbol
L(I01)
L(I0)
CTI
Symbol
T
T
V
V
I
I
60˚C for 10 seconds, 1.6 mm below seating plane
See Solder Reflow Thermal Profile section
Symbol
T
V
I
F
O
F
A
A
S
DD
O
DD
Value
.9
.8
0.08
≥ 175
IIIa
Units
mm
mm
mm
Volts
EN 60747-5-2:2001 + A1:2002
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 only)
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector; also
known as distance through insulation.
DIN IEC 11/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board
to achieve desired creepage and clearances. Creepage
and clearance distances will also change depending on
factors such as pollution degree and insulation level.
Minimum
–55
–0
0
–0.5
—
—
Minimum
–0
.5
10
Maximum
15
100
6.0
V
0

Maximum
100
5.5
16
DD
+ 0.5
Units
˚C
˚C
Volts
Volts
mA
mA
Units
˚C
V
mA