HCPL-2602-000E Avago Technologies US Inc., HCPL-2602-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-2602-000E
• Description: OPTOCOUPLER LOG-OUT 1CHAN 8-DIP
• Manufacturer: Avago Technologies US Inc.
• Type: Line Receiverr

Specifications of HCPL-2602-000E

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Input Type: AC, DC
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 0.01 us
• Maximum Forward Diode Current: 60 mA
• Output Device: Integrated Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 10 MBd
• Maximum Forward Diode Voltage: 2.7 V
• Maximum Reverse Diode Voltage: 0.95 V
• Maximum Power Dissipation: 40 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Number Of Elements: 1
• Output Type: Open Collector
• Baud Rate: 10Mbps
• Forward Voltage: 2.7V
• Forward Current: 60mA
• Output Current: 50mA
• Package Type: PDIP
• Operating Temp Range: 0C to 70C
• Power Dissipation: 40mW
• Propagation Delay Time: 75ns
• Pin Count: 8
• Mounting: Through Hole
• Reverse Breakdown Voltage: 0.95V
• Operating Temperature Classification: Commercial
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 60mA
• Output Voltage: 5.5V
• Opto Case Style: DIP
• No. Of Pins: 8
• Input Current Max: 60mA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1662-5

Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
5
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
Note: Non-halide flux should be used.
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
Symbol
TIME
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Value
0.08
200
IIIa
7.1
7.4
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.