MT8VDDT6464HG-335D1 Micron Technology Inc, MT8VDDT6464HG-335D1 Datasheet - Page 11

• Manufacturer Part Number: MT8VDDT6464HG-335D1
• Description: MODULE DDR SDRAM 512MB 200SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT6464HG-335D1

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 167MHz
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.4A
• Number Of Elements: 8
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 557-1127

Commands
Operation Truth Table, provide a general reference of
available commands. For a more detailed description
Table 8:
CKE is HIGH for all commands shown except SELF REFRESH; all states and sequences not shown are illegal or reserved
NOTE:
Table 9:
Used to mask write data; provided coincident with the corresponding data
pdf: 09005aef8092973f, source: 09005aef80921669
DD8C16_32_64x64HG.fm - Rev. B 9/04 EN
NAME (FUNCTION)
NAME (FUNCTION)
DESELECT (NOP)
NO OPERATION (NOP)
ACTIVE (Select device bank and activate row)
READ (Select device bank and column, and start READ burst)
WRITE (Select device bank and column, and start WRITE burst)
BURST TERMINATE
PRECHARGE (Deactivate row in device bank or banks)
AUTO REFRESH or SELF REFRESH (Enter self refresh mode)
LOAD MODE REGISTER
WRITE Enable
WRITE Inhibit
1. DESELECT and NOP are functionally interchangeable.
2. BA0–BA1 provide device bank address and A0–A11 (128MB) or A0–A12 (256MB, 512MB) provide row address.
3. BA0–BA1 provide device bank address; A0–A9 (128MB, 256MB) or A0–A9, A11 (512MB) provide column address; A10
4. Applies only to read bursts with auto precharge disabled; this command is undefined (and should not be used) for READ
5. A10 LOW: BA0–BA1 determine which device bank is precharged. A10 HIGH: all device banks are precharged and BA0-
6. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.
8. BA0–BA1 select either the mode register or the extended mode register (BA0 = 0, BA1 = 0 select the mode register; BA0
Figure 8, Commands Truth Table, and Figure 9, DM
HIGH enables the auto precharge feature (non-persistent), and A10 LOW disables the auto precharge feature.
bursts with auto precharge enabled and for WRITE bursts.
BA1 are “Don’t Care.”
= 1, BA1 = 0 select extended mode register; other combinations of BA0–BA1 are reserved).
A0–A11 (128MB) or A0–A12 (256MB, 512MB) provide the op-code to be written to the selected mode register.
Commands Truth Table
DM Operation Truth Table
11
of commands and operations, refer to the 128Mb,
256Mb, or 512Mb DDR SDRAM component data sheet.
128MB, 256MB, 512MB (x64, SR)
CS#
H
L
L
L
L
L
L
L
L
Micron Technology, Inc., reserves the right to change products or specifications without notice.
RAS#
H
H
H
H
X
L
L
L
L
200-PIN DDR SODIMM
CAS# WE#
X
H
H
H
H
L
L
L
L
X
H
H
H
H
L
L
L
L
©2004 Micron Technology, Inc. All rights reserved.
Bank/Row
Bank/Col
Bank/Col
Op-Code
ADDR
Code
DM
X
X
X
X
H
L
NOTES
Valid
DQS
6, 7
X
1
1
2
3
3
4
5
8