MT9VDDT3272G-335G3 Micron Technology Inc, MT9VDDT3272G-335G3 Datasheet - Page 11

• Manufacturer Part Number: MT9VDDT3272G-335G3
• Description: MODULE SDRAM DDR 256MB 184DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9VDDT3272G-335G3

• Memory Type: DDR SDRAM
• Memory Size: 256MB
• Speed: 333MT/s
• Package / Case: 184-DIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 12:
PDF: 09005aef80e119b2/Source: 09005aef80e11976
DD9C16_32_64x72.fm - Rev. D 1/08 EN
Parameter/Condition
Operating one bank active-precharge current:
t
Address and control inputs changing once every two clock cycles
Operating one bank active-read-precharge current: BL = 2;
t
changing once per clock cycle
Precharge power-down standby current: All device banks idle; Power-
down mode;
Idle standby current: CS# = HIGH; All device banks idle;
CKE = HIGH; Address and other control inputs changing once per clock
cycle; V
Active power-down standby current: One device bank active; Power-
down mode;
Active standby current: CS# = HIGH; CKE = HIGH; One device bank
active;
changing twice per clock cycle; Address and other control inputs changing
once per clock cycle
Operating burst read current: BL = 2; Continuous burst reads; One
device bank active; Address and control inputs changing once per clock
cycle;
Operating burst write current: BL = 2; Continuous burst writes; One
device bank active; Address and control inputs changing once per clock
cycle;
cycle
Auto refresh current
Self refresh current: CKE ≤ 0.2V
Operating bank interleave read current: Four device bank
interleaving reads (BL = 4) with auto precharge;
t
READ or WRITE commands
CK =
RC =
CK =
t
t
t
t
t
RC (MIN);
CK (MIN); DQ, DM, and DQS inputs changing once per clock cycle;
CK (MIN); Address and control inputs change only during active
CK =
CK =
IN
t
RC =
= V
t
t
REF
CK (MIN); I
CK (MIN); DQ, DM, and DQS inputs changing twice per clock
t
t
t
RAS (MAX);
I
Values are shown for the MT46V64M8 DDR SDRAM only and are computed from values specified in the
512Mb (64 Meg x 8) component data sheet
CK =
CK =
DD
for DQ, DM, and DQS
t
CK =
Specifications and Conditions – 512MB
t
t
CK (MIN); CKE = LOW
CK (MIN); CKE = LOW
t
CK (MIN); I
OUT
t
CK =
= 0mA
128MB, 256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM RDIMM
t
CK (MIN); DQ, DM, and DQS inputs
OUT
= 0mA; Address and control inputs
t
RC =
t
RC =
t
t
REFC =
REFC = 7.8125µs
t
RC (MIN);
t
t
RC (MIN);
CK =
11
t
RFC (MIN)
t
CK (MIN);
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
I
I
I
I
I
I
I
DD
DD
DD
I
I
DD
DD
DD
I
I
I
DD
DD
DD
DD
DD
DD
4W
3N
5A
2P
3P
4R
2F
0
1
5
6
7
1,170
1,440
1,485
1,395
2,610
3,600
-262
Electrical Specifications
405
315
450
45
90
45
©2003 Micron Technology, Inc. All rights reserved
-26A/
1,035
1,305
1,305
1,215
2,520
3,150
-265
360
270
405
45
90
45
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA