EL7566DRE-EVAL Intersil, EL7566DRE-EVAL Datasheet - Page 7

• Manufacturer Part Number: EL7566DRE-EVAL
• Description: DEMO BOARD FOR EL7566
• Manufacturer: Intersil

Specifications of EL7566DRE-EVAL

• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 1.8V
• Current - Output: 6A
• Voltage - Input: 3 ~ 6V
• Regulator Topology: Buck
• Frequency - Switching: 500kHz
• Board Type: Fully Populated
• Utilized Ic / Part: EL7566
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -

Typical Performance Curves
V
IN
FIGURE 9. HTSSOP THERMAL RESISTANCE vs PCB AREA
= V
D
= 5V, V
526
524
522
520
518
516
514
512
510
508
506
504
50
45
40
35
30
25
0
1
(NO AIR FLOW)
FIGURE 7. F
O
= 2.5V, I
2
1
3
O
V
V
2
S
IN
CONDITION:
28-Pin HTSSOP THERMAL PAD
SOLDERED TO 2-LAYER PCB
WITH 0.039" THICKNESS AND
1 OZ. COPPER ON BOTH SIDES
= 6A, f
PCB AREA (in
IN
=3.3V
vs LOAD CURRENT
4
=5V
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
7
I
O
S
3
5
(A)
= 500kHz, L = 2.7µH, C
6
2
4
)
7
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
5
0
0
8
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
6
9
25
AMBIENT TEMPERATURE (°C)
IN
= 100µF, C
EL7566
50
75
OUT
85
FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT
= 150µF, T
100
-0.05
-0.15
-0.25
-0.35
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.05
-0.1
-0.2
-0.3
125
0.1
0
0
A
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0
= 25°C unless otherwise noted. (Continued)
TEMPERATURE
FIGURE 8. LOAD REGULATIONS
150
25
1
AMBIENT TEMPERATURE (°C)
50
2
I
O
3
75
(A)
85
4
100
5
125
May 8, 2006
6
FN7102.7
150