PESD3V3S2UQ,115 NXP Semiconductors, PESD3V3S2UQ,115 Datasheet - Page 10

• Manufacturer Part Number: PESD3V3S2UQ,115
• Description: DIODE DBL ESD PROTECTION SOT663
• Manufacturer: NXP Semiconductors

Specifications of PESD3V3S2UQ,115

• Package / Case: SOT-663
• Voltage - Reverse Standoff (typ): 3.3V
• Voltage - Breakdown: 5.6V
• Power (watts): 150W
• Polarization: 2 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Clamping Voltage: 8 V
• Operating Voltage: 3.3 V
• Breakdown Voltage: 5.6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 15 A
• Peak Pulse Power Dissipation: 150 W
• Capacitance: 200 pF
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.3 mm W x 1.7 mm L x 0.6 mm H
• Operating Temperature Min Deg. C: -65C
• Operating Temperature Max Deg. C: 150C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4519-2; 934057839115; PESD3V3S2UQ T/R; PESD3V3S2UQ T/R

NXP Semiconductors
APPLICATION INFORMATION
The PESDxS2UQ series is designed for uni-directional protection for up to two data lines against damage caused by
ElectroStatic Discharge (ESD) and surge pulses. The PESDxS2UQ series may be used on lines where the signal
polarities are below ground. PESDxS2UQ series provide a surge capability of up to 150 W (P
waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The
following guidelines are recommended:
Place the PESDxS2UQ as close as possible to the input terminal or connector.
The path length between the PESDxS2UQ and the protected line should be minimized.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all printed-circuit board conductive loops including power and ground loops.
Minimize the length of transient return paths to ground.
Avoid using shared return paths to a common ground point.
Ground planes should be used whenever possible. For multilayer printed-circuit boards use ground vias.
Double ESD protection diodes
in SOT663 package
Fig.10 Typical application: ESD protection of data lines.
uni-directional protection
of two lines
line 1 to be protected
line 2 to be protected
PESDxS2UQ
ground
Rev. 03 - 11 September 2008
bi-directional protection
of one line
PESDxS2UQ
line 1 to be protected
ground
001aaa730
PESDxS2UQ series
pp
) per line for an 8/20 s
Product specification
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