PESD3V3L4UG,115 NXP Semiconductors, PESD3V3L4UG,115 Datasheet - Page 13

• Manufacturer Part Number: PESD3V3L4UG,115
• Description: DIODE QUAD ESD PROTECTION SOT353
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PESD3V3L4UG,115

• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Voltage - Reverse Standoff (typ): 3.3V
• Voltage - Breakdown: 5.32V
• Power (watts): 30W
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Clamping Voltage: 8 V
• Operating Voltage: 3.3 V
• Breakdown Voltage: 5.6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 30 W
• Capacitance: 28 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.05 mm W x 1.5 mm L x 0.5 mm H
• Number Of Elements: 4
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 5.32V
• Reverse Stand-off Voltage: 3.3V
• Leakage Current (max): 300nA
• Peak Pulse Current: 3A
• Test Current (it): 1mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4042-2; 934057784115; PESD3V3L4UG T/R; PESD3V3L4UG T/R

NXP Semiconductors
PESDXL4UF_G_W_4
Product data sheet
Fig 14. Reflow soldering footprint PESDxL4UG (SOT353/SC-88A)
Fig 15. Wave soldering footprint PESDxL4UG (SOT353/SC-88A)
Dimensions in mm
4.50
solder lands
solder resist
occupied area
Dimensions in mm
Low capacitance unidirectional quadruple ESD protection diode arrays
2.70
solder lands
solder paste
solder resist
occupied area
0.70
2.35
Rev. 04 — 28 February 2008
0.50
(4 )
transport direction during soldering
2.25
0.50
(4 )
1.15
3.75
2.65
1.20
2.40
PESDxL4UF/G/W
2.65
0.60
(1 )
0.40 0.90
© NXP B.V. 2008. All rights reserved.
0.30
sot353_fr
2.10
1.00
4.00
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