PIC24HJ64GP506-I/PT Microchip Technology, PIC24HJ64GP506-I/PT Datasheet - Page 14

IC PIC MCU FLASH 32KX16 64TQFP

PIC24HJ64GP506-I/PT

Manufacturer Part Number
PIC24HJ64GP506-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ64GP506-I/PT

Program Memory Type
FLASH
Program Memory Size
64KB (22K x 24)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
3-Wire/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
13
Operating Supply Voltage
0 V to 2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
18-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
8KB
Cpu Speed
40MIPS
No. Of Timers
13
Embedded Interface Type
CAN, I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ64GP506-I/PT
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Quantity:
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PIC24HJXXXGPX06/X08/X10
26. Module: Interrupt Controller
27. Module: Internal Voltage Regulator
TABLE 5:
DS80444D-page 14
Parameter No. Characteristic
Note 1:
If a clock failure occurs when the device is in Idle
mode, the oscillator failure trap does not vector to
the Trap Service Routine. Instead, the device will
simply wake-up from Idle mode and continue code
execution, if the Fail-Safe Clock Monitor (FSCM) is
enabled.
Work around
Whenever the device wakes up from Idle
(assuming the FSCM is enabled), the user
software should check the state of the OSCFAIL
bit (INTCON1<1>) to determine whether a clock
failure occurred, and then perform the appropriate
clock switch operation. Regardless, the Trap
Service Routine must be included in the user
application.
Affected Silicon Revisions
If a MCLR Reset pulse causes the device to wake-
up from Sleep mode, the device wakes up without
waiting for the on-chip voltage regulator to power-
up. This will subsequently result in a Brown-out
Reset (BOR).
Work around
None.
Affected Silicon Revisions
A2
A2
F20
X
X
2:
AC Characteristics
Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.
Devices set to initial frequency of 7.37 MHz (±2%) at 25°C.
A3
A3
X
X
INTERNAL FRC ACCURACY
A4
A4
X
X
Internal FRC Accuracy @ FRC Frequency = 7.37 MHz
Min.
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
-3
Operating temperature -40°C < TA < +85°C for industrial
Typical
Max.
+3
28. Module: ECAN
29. Module: Oscillator
The C1RXOVF2 and C2RXOVF2 registers are
non-functional. They are always read back as
0x0000, even when a receive overflow has
occurred.
Work around
None.
Affected Silicon Revisions
The device does not meet the internal FRC
accuracy specifications in the data sheet (Table
23-18 of the “PIC24HJXXXGPX06/X08/X10 Data
Sheet”
specifications are shown in Table 5.
Work around
None.
Affected Silicon Revisions
A2
A2
Units
X
X
%
A3
A3
X
X
(DS70175)).
-40°C < TA < +85°C V
A4
A4
X
X
(1,2)
© 2010 Microchip Technology Inc.
Conditions
The
actual
DD
= 3.0-3.6V
accuracy

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