PIC24FJ256GB110-I/PF Microchip Technology, PIC24FJ256GB110-I/PF Datasheet - Page 26

• Manufacturer Part Number: PIC24FJ256GB110-I/PF
• Description: IC PIC MCU FLASH 256K 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ256GB110-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 83
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 84
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

programming process. After entering Enhanced ICSP
programmed, followed by the configuration locations.
PIC24FJXXXGA1/GB1
4.0
This section discusses programming the device
through Enhanced ICSP and the programming execu-
tive. The programming executive resides in executive
memory (separate from code memory) and is executed
when Enhanced ICSP Programming mode is entered.
The programming executive provides the mechanism
for the programmer (host device) to program and verify
the PIC24FJXXXGA1/GB1 devices using a simple
command set and communication protocol. There are
several basic functions provided by the programming
executive:
• Read Memory
• Erase Memory
• Program Memory
• Blank Check
• Read Executive Firmware Revision
The programming executive performs the low-level
tasks required for erasing, programming and verifying
a device. This allows the programmer to program the
device by issuing the appropriate commands and data.
Table 4-1 summarizes the commands. A detailed
description for each command is provided in
Section 5.2 “Programming Executive Commands”.
TABLE 4-1:
The programming executive uses the device’s data
RAM for variable storage and program execution. After
the programming executive has run, no assumptions
should be made about the contents of data RAM.
4.1
Figure 4-1 shows the high-level overview of the
mode, the programming executive is verified. Next, the
device is erased. Then, the code memory is
Code memory (including the Configuration registers) is
then verified to ensure that programming was successful.
DS39907A-page 26
SCHECK
READC
READP
PROGP
PROGW
QBLANK
QVER
Command
DEVICE PROGRAMMING –
ENHANCED ICSP
Overview of the Programming
Process
Sanity Check
Program One Row of Code Memory
and Verify
Program One Word of Code Memory
and Verify
Query if the Code Memory is Blank
Read Device ID Registers
Read Code Memory
Query the Software Version
COMMAND SET SUMMARY
Description
executive memory is read. If the programming executive
executive must be programmed to executive code
memory using the method described in Section 5.4
After the programming executive has been verified
in memory
PIC24FJXXXGA1/GB1 families can be programmed
using the command set shown in Table 4-1.
FIGURE 4-1:
4.2
Before programming can begin, the programmer must
confirm that the programming executive is stored in
executive memory. The procedure for this task is
shown in Figure 4-2.
First, In-Circuit Serial Programming mode (ICSP) is
entered. Then, the unique Application ID Word stored in
is resident, the Application ID Word is BBh, which means
programming can resume as normal. However, if the
Application ID Word is not BBh, the programming
“Programming the Programming Executive to
Memory”.
Section 3.0 “Device Programming – ICSP” describes
the ICSP programming method. Section 3.11 “Reading
the Application ID Word” describes the procedure for
reading the Application ID Word in ICSP mode.
Confirming the Presence of the
Programming Executive
(or
Program Configuration Bits
Verify Configuration Bits
Enter Enhanced ICSP™
HIGH-LEVEL ENHANCED
ICSP™ PROGRAMMING FLOW
Exit Enhanced ICSP
loaded
Program Memory
Verify Program
Perform Chip
© 2007 Microchip Technology Inc.
Erase
Done
Start
if
not
present),
the