AT89C51ED2-SLSUM Atmel, AT89C51ED2-SLSUM Datasheet - Page 130
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AT89C51ED2-SLSUM
Manufacturer Part Number
AT89C51ED2-SLSUM
Description
IC 8051 MCU FLASH 64K 44PLCC
Manufacturer
Atmel
Series
89Cr
Datasheet
1.ATWEBDVK-02RC.pdf
(137 pages)
Specifications of AT89C51ED2-SLSUM
Core Processor
8051
Core Size
8-Bit
Speed
60MHz
Connectivity
SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
34
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-PLCC
Package
44PLCC
Device Core
8051
Family Name
89C
Maximum Speed
40 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
34
Interface Type
SPI/UART
Number Of Timers
3
Processor Series
AT89x
Core
8051
Data Ram Size
2 KB
Maximum Clock Frequency
40 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 40 C
Cpu Family
AT89
Device Core Size
8b
Frequency (max)
40MHz
Total Internal Ram Size
2KB
# I/os (max)
34
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PLCC
For Use With
AT89OCD-01 - USB EMULATOR FOR AT8XC51 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT89C51ED2-SLSUM
Manufacturer:
MITSUBISHI
Quantity:
43
Part Number:
AT89C51ED2-SLSUM
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
130
STANDARD NOTES FOR PQFP/ VQFP / TQFP / DQFP
AT89C51RD2/ED2
1/ CONTROLLING DIMENSIONS : INCHES
2/ ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 14.5M -
1982.
3/ "D1 AND E1" DIMENSIONS DO NOT INCLUDE MOLD PROTUSIONS.
THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM
4/ DATUM PLANE "H" LOCATED AT MOLD PARTING LINE AND
COINCIDENT WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT
5/ DATUM "A" AND "D" TO BE DETERMINED AT DATUM PLANE H.
6/ DIMENSION " f " DOES NOT INCLUDE DAMBAR PROTUSION ALLOWABLE
" f " DIMENSION AT MAXIMUM MATERIAL CONDITION .
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT.
MOLD PROTUSIONS SHALL NOT EXCEED 0.25 mm (0.010 INCH).
PACKAGE BODY SIZE BY AS MUCH AS 0.15 mm.
BOTTOM OF PARTING LINE.
DAMBAR PROTUSION SHALL BE 0.08mm/.003" TOTAL IN EXCESS OF THE
4235K–8051–05/08