LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 13
![IC ARM7 MCU FLASH 512K 100LQFP](/photos/6/65/66516/568-100-lqfp_sot407-1_sml.jpg)
LPC2387FBD100,551
Manufacturer Part Number
LPC2387FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Specifications of LPC2387FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
Development Tools By Supplier
OM11013
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
98KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-4322
935284932551
LPC2387FBD100-S
935284932551
LPC2387FBD100-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2387FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 3.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
7. Functional description
LPC2387_3
Product data sheet
Symbol
V
VREF
VBAT
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
output functionality. When power is switched off, this pin connected to the I
Open-drain configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis
Pad provides special analog functionality.
Pad provides special analog functionality.
Pin description
7.1 Architectural overview
Pin
10
12
19
The LPC2387 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals, and the AMBA
APB for connection to other on-chip peripheral functions. The microcontroller permanently
configures the ARM7TDMI-S processor for little-endian byte order.
The LPC2387 implements two AHB in order to allow the Ethernet block to operate without
interference caused by other system activity. The primary AHB, referred to as AHB1,
includes the VIC and GPDMA controller.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
[13]
[13]
[13]
…continued
Type
I
I
I
Description
analog 3.3 V pad supply voltage: This should be nominally the same voltage
as V
used to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
should be isolated to minimize noise and error. Level on this pin is used as a
reference for ADC and DAC.
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
DD(3V3)
Rev. 03 — 29 October 2008
2
but should be isolated to minimize noise and error. This voltage is
C-bus 400 kHz specification. This pad requires an external pull-up to provide
2
C-bus is floating and does not disturb the I
Single-chip 16-bit/32-bit microcontroller
LPC2387
© NXP B.V. 2008. All rights reserved.
DD(3V3)
2
C lines.
but
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