LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 48
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LPC2387FBD100,551
Manufacturer Part Number
LPC2387FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Specifications of LPC2387FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
Development Tools By Supplier
OM11013
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
98KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-4322
935284932551
LPC2387FBD100-S
935284932551
LPC2387FBD100-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2387FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
13. Abbreviations
LPC2387_3
Product data sheet
Table 9.
Acronym
ADC
AHB
AMBA
APB
BOD
CAN
DAC
DCC
DMA
DSP
EOP
ETM
GP
GPIO
IrDA
JTAG
MII
MIIM
PHY
PLL
PWM
RMII
SE0
SPI
SSI
SSP
TTL
UART
USB
Abbreviations
Description
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Microcontroller Bus Architecture
Advanced Peripheral Bus
BrownOut Detection
Controller Area Network
Digital-to-Analog Converter
Debug Communication Channel
Direct Memory Access
Digital Signal Processing
End Of Packet
Embedded Trace Macrocell
General Purpose
General Purpose Input/Output
Infrared Data Association
Joint Test Action Group
Media Independent Interface
Media Independent Interface Management
Physical Layer
Phase-Locked Loop
Pulse Width Modulator
Reduced Media Independent Interface
Single Ended Zero
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
Universal Serial Bus
Rev. 03 — 29 October 2008
Single-chip 16-bit/32-bit microcontroller
LPC2387
© NXP B.V. 2008. All rights reserved.
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