MCF52213CAE50 Freescale Semiconductor, MCF52213CAE50 Datasheet - Page 30
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MCF52213CAE50
Manufacturer Part Number
MCF52213CAE50
Description
IC MCU 32BIT 128K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5221xr
Datasheet
1.MCF52213CAE50.pdf
(56 pages)
Specifications of MCF52213CAE50
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF522x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, QSPI, UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
43
Number Of Timers
18
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52210DEMO, M52211EVB
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
A/d Bit Size
12 bit
A/d Channels Available
8
Height
1.4 mm
Length
10 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Width
10 mm
For Use With
M52210DEMO - BOARD DEV MCF5221X LOW COST
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF52213CAE50
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2.4
The flash memory characteristics are shown in
Freescale Semiconductor
1
2
System clock (read only)
System clock (program/erase)
1
2
3
4
5
6
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
for a known T
any value of T
Refer to the flash memory section for more information
Depending on packaging; see the orderable part number summary.
recommends the use of
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
JA
and
Flash Memory Characteristics
T
P
P
P
A
D
INT
I/O
jt
JA
A
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
A
. Using this value of K, the values of P
.
Parameter
= ambient temperature, C
= package thermal resistance, junction-to-ambient, C/W
= P
= chip internal power, I
= power dissipation on input and output pins — user determined, watts
I/O
INT
P
Table 23. SGFM Flash Program and Erase Characteristics
JA
P
INT
K = P
2
and power dissipation specifications in the system design to prevent device junction
I/O
and can be ignored. An approximate relationship between P
D
(T
MCF52211 ColdFire Microcontroller, Rev. 2
J
A
) in C can be obtained from:
+ 273 C) +
P
DD
T
Table 23
D
J
V
=
=
K
T
DD
(V
A
D
DD
+
, watts
and T
Symbol
f
and
sys(P/E)
f
T
sys(R)
P
J
= 3.0 to 3.6 V)
JMA
+
D
Table
J
273C
can be obtained by solving equations (1) and (2) iteratively for
P
JMA
D
24.
2
(1)
(2)
(3)
0.15
Min
0
Typ
—
—
D
jt
and T
parameter, the device power
Electrical Characteristics
J
(if P
50–80
102.4
Max
I/O
D
is neglected) is:
1
(at equilibrium)
MHz
MHz
Unit
30