MCF52213CAE50 Freescale Semiconductor, MCF52213CAE50 Datasheet - Page 32

IC MCU 32BIT 128K FLASH 64-LQFP

MCF52213CAE50

Manufacturer Part Number
MCF52213CAE50
Description
IC MCU 32BIT 128K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5221xr
Datasheet

Specifications of MCF52213CAE50

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF522x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, QSPI, UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
43
Number Of Timers
18
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52210DEMO, M52211EVB
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
A/d Bit Size
12 bit
A/d Channels Available
8
Height
1.4 mm
Length
10 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Width
10 mm
For Use With
M52210DEMO - BOARD DEV MCF5221X LOW COST
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF52213CAE50
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2.6
2.7
Freescale Semiconductor
Supply voltage
Standby voltage
Input high voltage
Input low voltage
Input hysteresis
Low-voltage detect trip voltage (V
Low-voltage detect hysteresis (V
Input leakage current
Output high voltage (all input/output and all output pins)
I
Output low voltage (all input/output and all output pins)
I
OH
OL
V
= 2.0mA
= –2.0 mA
in
= V
ESD Protection
DC Electrical Specifications
DD
or V
1
2
Characteristics
ESD target for Human Body Model
ESD target for Machine Model
HBM circuit description
MM circuit description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of pulses
2
• Positive pulses
• Negative pulses
• Positive pulses
• Negative pulses
SS
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
, digital pins
Characteristic
DD
DD
Table 26. ESD Protection Characteristics
rising)
falling)
Table 27. DC Electrical Specifications
MCF52211 ColdFire Microcontroller, Rev. 2
Symbol
R
R
HBM
MM
series
series
C
C
V
Symbol
V
LVDHYS
V
V
V
V
V
STBY
V
V
HYS
I
LVD
Value
DD
OH
in
OL
2000
1500
IH
IL
200
100
200
0
1
1
3
3
1
1
1, 2
0.06  V
0.7  V
V
V
SS
DD
2.15
–1.0
Min
3.0
1.8
60
– 0.3
– 0.5
DD
DD
Units
sec
pF
pF
V
V
Electrical Characteristics
0.35  V
Max
120
3.6
3.5
4.0
2.3
1.0
0.5
DD
Unit
mV
mV
A
V
V
V
V
V
V
V
32

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