DF2338VFC25V Renesas Electronics America, DF2338VFC25V Datasheet - Page 100

IC H8S/2300 MCU FLASH 144QFP

DF2338VFC25V

Manufacturer Part Number
DF2338VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2338VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2338VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
2.9.4
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or
three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to
section 6, Bus Controller.
2.10
2.10.1
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS
instruction is not generated by the Renesas H8S and H8/300 Series C/C++ compilers. If the TAS
instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or
ER5 is used.
Rev.4.00 Sep. 07, 2007 Page 68 of 1210
REJ09B0245-0400
External Address Space Access Timing
Usage Note
TAS Instruction
φ
Address bus
AS
RD
HWR, LWR
Data bus
Figure 2.17 Pin States during On-Chip Supporting Module Access
T
High-impedance state
1
Unchanged
Bus cycle
High
High
High
T
2

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