DF2338VFC25V Renesas Electronics America, DF2338VFC25V Datasheet - Page 26
![IC H8S/2300 MCU FLASH 144QFP](/photos/12/22/122201/df2338vfc25v_sml.jpg)
DF2338VFC25V
Manufacturer Part Number
DF2338VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets
1.HEWH8E10A.pdf
(19 pages)
2.D12312SVTE25V.pdf
(341 pages)
3.DF2338VFC25V.pdf
(1246 pages)
Specifications of DF2338VFC25V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2338VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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16.6 Usage Notes ...................................................................................................................... 716
Section 17 D/A Converter
17.1 Overview........................................................................................................................... 721
17.2 Register Descriptions ........................................................................................................ 724
17.3 Operation........................................................................................................................... 727
Section 18 RAM
18.1 Overview........................................................................................................................... 729
18.2 Register Descriptions ........................................................................................................ 730
18.3 Operation........................................................................................................................... 731
18.4 Usage Note........................................................................................................................ 731
Section 19 ROM
19.1 Overview........................................................................................................................... 733
19.2 Register Descriptions ........................................................................................................ 734
19.3 Operation........................................................................................................................... 735
19.4 Overview of Flash Memory (H8S/2339 F-ZTAT)............................................................ 738
Rev.4.00 Sep. 07, 2007 Page xxiv of xxx
17.1.1 Features................................................................................................................ 721
17.1.2 Block Diagram..................................................................................................... 722
17.1.3 Pin Configuration................................................................................................. 723
17.1.4 Register Configuration......................................................................................... 723
17.2.1 D/A Data Registers 0 to 3 (DADR0 to DADR3) ................................................. 724
17.2.2 D/A Control Registers 01 and 23 (DACR01, DACR23) ..................................... 724
17.2.3 Module Stop Control Register (MSTPCR) .......................................................... 726
18.1.1 Block Diagram..................................................................................................... 729
18.1.2 Register Configuration......................................................................................... 730
18.2.1 System Control Register (SYSCR) ...................................................................... 730
19.1.1 Block Diagram..................................................................................................... 733
19.1.2 Register Configuration......................................................................................... 734
19.2.1 Mode Control Register (MDCR) ......................................................................... 734
19.2.2 Bus Control Register L (BCRL) .......................................................................... 735
19.4.1 Features................................................................................................................ 738
19.4.2 Overview.............................................................................................................. 739
19.4.3 Flash Memory Operating Modes ......................................................................... 740
19.4.4 On-Board Programming Modes........................................................................... 741
19.4.5 Flash Memory Emulation in RAM ...................................................................... 743
19.4.6 Differences between Boot Mode and User Program Mode ................................. 744
19.4.7 Block Configuration............................................................................................. 745
19.4.8 Pin Configuration................................................................................................. 746
.................................................................................................................. 729
.................................................................................................................. 733
................................................................................................. 721
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