DF2338VFC25V Renesas Electronics America, DF2338VFC25V Datasheet - Page 869
![IC H8S/2300 MCU FLASH 144QFP](/photos/12/22/122201/df2338vfc25v_sml.jpg)
DF2338VFC25V
Manufacturer Part Number
DF2338VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets
1.HEWH8E10A.pdf
(19 pages)
2.D12312SVTE25V.pdf
(341 pages)
3.DF2338VFC25V.pdf
(1246 pages)
Specifications of DF2338VFC25V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2338VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 869 of 1246
- Download datasheet (7Mb)
AC Characteristics
Table 19.41 AC Characteristics in Auto-Erase Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
Status polling start time
Status polling access time
Memory erase time
WE rise time
WE fall time
Erase setup time
Erase end setup time
I/O
A
5
18
to I/O
FWE
to A
I/O
I/O
WE
OE
CE
0
7
6
0
CC
= 3.3 V ±0.3 V, V
t
ens
Figure 19.53 Auto-Erase Mode Timing Waveforms
t
ces
t
f
t
ds
t
wep
H'20
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
ests
spa
erase
r
f
ens
enh
t
t
ceh
SS
r
t
dh
= 0 V, T
t
nxtc
a
= 25°C ±5°C
Min
20
0
0
50
50
70
1
—
100
—
—
100
100
H'20
Erase end identifi-
cation signal
Erase normal end
confirmation signal
t
Rev.4.00 Sep. 07, 2007 Page 837 of 1210
ests
t
erase
t
spa
Max
—
—
—
—
—
—
—
150
40000
30
30
—
—
H'00
t
enh
t
nxtc
REJ09B0245-0400
Unit
µs
ns
ns
ns
ns
ns
ms
ns
ms
ns
ns
ns
ns
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