LPC2158FBD100,551 NXP Semiconductors, LPC2158FBD100,551 Datasheet - Page 34

• Manufacturer Part Number: LPC2158FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2158FBD100,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 14x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 40 KB
• Interface Type: I2C, SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 2
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, LCD-DEMO-LPC2158
• Development Tools By Supplier: OM11020
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 10 bit, 1 Channel
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4691; 935287349551; LPC2158FBD100-S

NXP Semiconductors
Table 7.
T
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Applies to P1[16] to P1[31].
[11] On pin VBAT.
[12] Optimized for low battery consumption.
[13] To V
[14] Includes external resistors of 18
LPC2157_2158_1
Product data sheet
Symbol
V
V
V
USB pins
I
V
V
V
V
V
V
C
Z
R
OZ
amb
DRV
o(XTAL2)
i(RTCX1)
o(RTCX2)
BUS
DI
CM
th(rs)se
OL
OH
trans
pu
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
Core and external rail.
The RTC typically fails when V
Including voltage on outputs in 3-state mode.
V
3-state outputs go into 3-state mode when V
Accounts for 100 mV voltage drop in all supply lines.
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
Minimum condition for V
= 40 C to +85 C for commercial applications, unless otherwise specified.
DD
SS
supply voltages must be present.
.
Static characteristics
Parameter
output voltage on pin
XTAL2
input voltage on pin
RTCX1
output voltage on pin
RTCX2
OFF-state output
current
bus supply voltage
differential input
sensitivity voltage
differential common
mode voltage range
single-ended receiver
switching threshold
voltage
LOW-level output
voltage
HIGH-level output
voltage
transceiver capacitance pin to GND
driver output impedance
for driver which is not
high-speed capable
pull-up resistance
I
= 4.5 V, maximum condition for V
i(VBAT)
…continued
1 % on D+ and D .
drops below 1.6 V.
Conditions
0 V < V
|(D+)
includes V
R
R
steady state drive
SoftConnect = ON
L
L
of 1.5 k to 3.6 V
of 15 k to GND
DD
I
(D )|
is grounded.
< 3.3 V
DI
Rev. 01 — 15 October 2008
range
I
= 5.5 V.
[14]
Single-chip 16-bit/32-bit microcontrollers
Min
0
0
0
-
-
0.2
0.8
0.8
-
2.8
-
29
1.1
LPC2157/2158
Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
[1]
© NXP B.V. 2008. All rights reserved.
Max
1.8
1.8
1.8
5.25
-
2.5
2.0
0.3
3.6
20
44
1.9
10
34 of 45
Unit
V
V
V
V
V
V
V
V
V
pF
k
A