C8051F705-GM Silicon Laboratories Inc, C8051F705-GM Datasheet - Page 38

• Manufacturer Part Number: C8051F705-GM
• Description: IC 8051 MCU 15K FLASH 48-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F70xr

Specifications of C8051F705-GM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 15KB (15K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 32 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: C8051F7x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F700DK
• Minimum Operating Temperature: - 40 C
• Height: 0.95 mm
• Length: 7 mm
• Supply Voltage (max): 1.9 V, 3.6 V
• Supply Voltage (min): 1.7 V, 1.8 V
• Width: 7 mm
• For Use With: 336-1635 - DEV KIT FOR C8051F700
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1612-5

C8051F70x/71x
38
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 m minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C1
C2
E
X
Y
Table 4.2. TQFP-64 PCB Land Pattern Dimensions
Figure 4.2. TQFP-64 PCB Land Pattern
Rev. 1.0
11.30
11.30
0.20
1.40
Min
0.50 BSC
11.40
11.40
Max
0.30
1.50