DSPIC30F2020-30I/MMB32 Microchip Technology, DSPIC30F2020-30I/MMB32 Datasheet - Page 258
![IC DSPIC MCU/DSP 12K 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC30F2020-30I/MMB32
Manufacturer Part Number
DSPIC30F2020-30I/MMB32
Description
IC DSPIC MCU/DSP 12K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F1010-30ISO.pdf
(26 pages)
4.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2020-30I/MMB32
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
Q4035438A
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F2020-30I/MMB32
Manufacturer:
Microchip Technology
Quantity:
135
- AC164335 PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F1010-30ISO PDF datasheet #3
- DSPIC30F1010-30ISO PDF datasheet #4
- Current page: 258 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
FIGURE 21-14:
TABLE 21-29: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70178C-page 256
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
2:
3:
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SDI
SS
SCK
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH2ssH
X
X
TscL2ssH
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
X
Symbol
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
SS
SS
High-impedance
SS
SP50
X
X
X
X
X
X
X
X
X
X
X
after SCK Edge
to SCK
to SDO
Input Low Time
Input High Time
Input Fall Time
Input Rise Time
Edge
SP35
Data Output Fall Time
Data Output Rise Time
Data Output Valid after
X
X
Characteristic
SP71
Edge
Edge
SP40
X
X
Output
MSb IN
(3)
or SCK
MSb
X
SP41
SP70
X
Data Input
Data Input
(3)
(3)
(1)
X
SP30,SP31
Input
Preliminary
(3)
(3)
BIT14 - - - - - -1
BIT14 - - - -1
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature
1.5 T
Note: Refer to Figure 21-1 for load conditions.
+ 40
Min
120
30
30
20
20
10
—
—
—
—
—
CY
SP73
SP72
Typ
—
—
10
10
—
—
—
—
—
—
—
—
(2)
SP72
SP73
Max
LSb
LSb IN
—
—
25
25
—
—
30
—
—
—
50
—
SP52
-40°C T
-40°C T
Units
© 2006 Microchip Technology Inc.
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
+85°C for Industrial
+125°C for Extended
See parameter D032
See parameter D031
Conditions
—
—
—
—
—
—
—
—
—
—
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