DSPIC30F2020-30I/MMB32 Microchip Technology, DSPIC30F2020-30I/MMB32 Datasheet - Page 270
![IC DSPIC MCU/DSP 12K 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC30F2020-30I/MMB32
Manufacturer Part Number
DSPIC30F2020-30I/MMB32
Description
IC DSPIC MCU/DSP 12K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F1010-30ISO.pdf
(26 pages)
4.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2020-30I/MMB32
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
Q4035438A
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F2020-30I/MMB32
Manufacturer:
Microchip Technology
Quantity:
135
- AC164335 PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F1010-30ISO PDF datasheet #3
- DSPIC30F1010-30ISO PDF datasheet #4
- Current page: 270 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
DS70178C-page 268
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
Dimension Limits
A1
2
1
Preliminary
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
—
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
© 2006 Microchip Technology Inc.
—
L
b
e
K
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