AT32UC3A0512-ALUT Atmel, AT32UC3A0512-ALUT Datasheet - Page 390
AT32UC3A0512-ALUT
Manufacturer Part Number
AT32UC3A0512-ALUT
Description
IC MCU AVR32 512KB FLASH 144LQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Specifications of AT32UC3A0512-ALUT
Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
109
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Package
144LQFP
Device Core
AVR32
Family Name
AT32
Maximum Speed
66 MHz
Operating Supply Voltage
1.8|3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
69
Interface Type
Ethernet/I2S/JTAG/SPI/TWI/USART
Number Of Timers
3
Processor Series
AT32UC3x
Core
AVR32
Data Ram Size
64 KB
Maximum Clock Frequency
66 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1100, ATEVK1105, ATAVRRZ600
Minimum Operating Temperature
- 40 C
For Use With
ATEVK1105 - KIT EVAL FOR AT32UC3A0ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
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Manufacturer
Quantity
Price
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Part Number:
AT32UC3A0512-ALUT
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27.6.6.2
Figure 27-23. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
27.6.6.3
32058J–AVR32–04/11
CLK_SMC
D[15:0]
A[25:2]
NCS0
NWE
NRD
TDF Optimization Enabled (TDF_MODE = 1)
TDF Optimization Disabled (TDF_MODE = 0)
Read access on NCS0 (NRD controlled)
When the TDF_MODE of the MODE register is set to 1 (TDF optimization is enabled), the SMC
takes advantage of the setup period of the next access to optimize the number of wait states
cycle to insert.
Figure 27-23
NWE, on Chip Select 0. Chip Select 0 has been programmed with:
NRD_HOLD = 4; READ_MODE = 1 (NRD controlled)
NWE_SETUP = 3; WRITE_MODE = 1 (NWE controlled)
TDF_CYCLES = 6; TDF_MODE = 1 (optimization enabled).
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period is ended when the second access begins. If the hold period of the read1
controlling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
27-24,
shows a read access controlled by NRD, followed by a write access controlled by
NRD_HOLD = 4
Figure 27-25
TDF_CYCLES = 6
and
Figure 27-26
Read to Write
Wait State
NWE_SETUP = 3
illustrate the cases:
write access on NCS0 (NWE controlled)
AT32UC3A
390
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