STM32F103C8T6TR STMicroelectronics, STM32F103C8T6TR Datasheet - Page 93

• Manufacturer Part Number: STM32F103C8T6TR
• Description: MCU ARM 64KB FLASH MEM 48-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103C8T6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

STM32F103x8, STM32F103xB
Table 59.
22-May-2008
14-Mar-2008
21-Mar-2008
Date
Document revision history (continued)
Revision
5
6
7
Figure 2: Clock tree on page 12
Maximum T
page
CRC feature added (see
unit on page 9
I
Stop and Standby
ACC
note 2 removed.
P
in
t
V
page
Table 41: SPI characteristics on page 67
I
Table 47: ADC accuracy - limited test conditions
accuracy
LQFP100 package specifications updated (see
characteristics on page
Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36
footprints added (see
Section 6.2: Thermal characteristics on page 86
Section 6.2.1
Appendix A: Important notes on page 81
Small text changes.
In
– N
– cycling conditions specified for t
– t
V
CRC feature removed.
CRC feature added back. Small text changes.
modified.
I
current consumptions in Stop and Standby modes on page
I
Standby mode on page
Values added to
V) on page
Figure 32: SPI timing diagram - slave mode and CPHA = 0 on page 68
modified.
t
data retention on page
V
Figure 54: LQFP100 P
Axx option added to
page
DD
RET
VREF
DD
DD_VBAT
RET
D
NF(NRST)
25
USB
Table 28: Flash memory characteristics on page
Table 29: Flash memory endurance and data
, T
RET
Doc ID 13587 Rev 12
, Avg_Slope and T
modified in
END
at T
HSI
modified in
at T
A
36.
63.
89.
added to
added to
and T
min modified at T
A
modified in
tested over the whole temperature range
A
removed from
max = 105 °C added to
modified.
Section 2.2: Full compatibility throughout the family
Equation 1
= 105 °C modified in
unit corrected in
66.
J
J
value given in
added, t
and
and
Table 16: Typical and maximum current consumptions in
Table 43: USB DC electrical characteristics on page
Table 45: ADC characteristics on page
Table 29: Flash memory endurance and data
Table 40: SCL frequency (f
Section 6.2.2
modes.
Figure 10: Memory map on page 32
Table 24: HSI oscillator characteristics on page
Figure 10: Memory map
Table 58: Ordering information scheme on
corrected.
Figure
prog
L
D
55.
modified in
Table 21: Typical current consumption in
76).
A
47.
max vs. T
CRC (cyclic redundancy check) calculation
= 55 °C
values modified and t
Table 37: NRST pin characteristics on
Table 8: Thermal characteristics on
47,
Changes
Table 29: Flash memory endurance and
added.
added.
Figure
Table 16: Typical and maximum
RET
A
Table 49: TS
on page 88
49,
modified.
removed.
Figure 53
PCLK1
clarified.
Section 1: Introduction
prog
Section 6: Package
modified.
retention:
added.
characteristics.
modified,
= 36 MHz.,V
54.
description clarified
Revision history
and
71.
Table 48: ADC
for address).
Figure
43.
added.
retention.
DD
= 3.3
41).
93/96
53,
70.