STM32F107VCT6 STMicroelectronics, STM32F107VCT6 Datasheet - Page 35

• Manufacturer Part Number: STM32F107VCT6
• Description: MCU ARM 256KB FLASH MEM 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F107VCT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: DMA, POR, PWM, Voltage Detect, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F107x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 10
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit x 2, 16 Channel
• On-chip Dac: 12 bit x 2, 2 Channel
• For Use With: 497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-8913

STM32F105xx, STM32F107xx
5.3
5.3.1
Table 8.
Operating conditions
General operating conditions
Table 9.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. If T
5. In low power dissipation state, T
Symbol
V
between V
f
f
f
PCLK1
PCLK2
V
DDA
HCLK
V
P
P
T
T
BAT
DD
Symbol
A
A
A
D
D
J
T
is lower, higher P
is lower, higher P
(1)
STG
T
J
DD
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
for suffix 6 or T
suffix 7
Power dissipation at T
for suffix 6 or T
suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
and V
DDA
(3)
(4)
Storage temperature range
Maximum junction temperature
D
D
Parameter
can be tolerated during power-up and operation.
values are allowed as long as T
values are allowed as long as T
A
A
DD
= 105 °C for
= 105 °C for
Table 51: ADC
A
and V
Doc ID 15274 Rev 5
can be extended to this range as long as T
A
A
= 85 °C
= 85 °C
DDA
Ratings
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LFBGA100
LQFP100
LQFP64
LQFP100
LQFP64
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
DD
J
J
(2)
does not exceed T
does not exceed T
Conditions
(5)
(5)
J
J
J
Electrical characteristics
max.
max.
does not exceed T
–65 to +150
Value
150
Min
–40
–40
–40
–40
–40
–40
2.4
1.8
0
0
0
2
2
Max
500
434
444
434
444
105
105
125
105
125
3.6
3.6
3.6
3.6
72
36
72
85
J
max.
Unit
35/101
MHz
°C
°C
Unit
mW
mW
°C
°C
°C
V
V
V