STM32F107VCT6 STMicroelectronics, STM32F107VCT6 Datasheet - Page 37

• Manufacturer Part Number: STM32F107VCT6
• Description: MCU ARM 256KB FLASH MEM 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F107VCT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: DMA, POR, PWM, Voltage Detect, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F107x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 10
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit x 2, 16 Channel
• On-chip Dac: 12 bit x 2, 2 Channel
• For Use With: 497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-8913

STM32F105xx, STM32F107xx
5.3.4
5.3.5
Embedded reference voltage
The parameters given in
temperature and V
Table 12.
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in
measurement
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to Dhrystone 2.1 code.
Maximum current consumption
The MCU is placed under the following conditions:
●
●
●
●
●
The parameters given in
under ambient temperature and V
T
V
Symbol
V
S_vrefint
T
RERINT
Coeff
REFINT
All I/O pins are in input mode with a static value at V
All peripherals are disabled except when explicitly mentioned
The Flash memory access time is adjusted to the f
to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above)
Prefetch in ON (reminder: this bit must be set before clock setting and bus prescaling)
When the peripherals are enabled f
(2)
(2)
(1)
Internal reference voltage
ADC sampling time when
reading the internal reference
voltage
Internal reference voltage
spread over the temperature
range
Temperature coefficient
Embedded internal reference voltage
scheme.
DD
Parameter
supply voltage conditions summarized in
Table 12
Table
Doc ID 15274 Rev 5
13,
DD
are derived from tests performed under ambient
Table 14
supply voltage conditions summarized in
PCLK1
–40 °C < T
–40 °C < T
V
and
DD
Conditions
= f
= 3 V ±10 mV
Table 15
HCLK
A
A
< +105 °C 1.16
< +85 °C
/2, f
Figure 9: Current consumption
HCLK
DD
are derived from tests performed
PCLK2
or V
frequency (0 wait state from 0
Table
1.16
Min
= f
SS
Electrical characteristics
HCLK
(no load)
9.
1.20
1.20
Typ
5.1
17.1
Max
1.26
1.24
100
10
Table
(2)
ppm/°C
9.
Unit
37/101
mV
µs
V
V