STM32F107VCT6 STMicroelectronics, STM32F107VCT6 Datasheet - Page 49

• Manufacturer Part Number: STM32F107VCT6
• Description: MCU ARM 256KB FLASH MEM 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F107VCT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: DMA, POR, PWM, Voltage Detect, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F107x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 10
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit x 2, 16 Channel
• On-chip Dac: 12 bit x 2, 2 Channel
• For Use With: 497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-8913

STM32F105xx, STM32F107xx
5.3.7
Internal clock source characteristics
The parameters given in
temperature and V
High-speed internal (HSI) RC oscillator
Table 24.
1. V
2. Refer to application note AN2868 “STM32F10xxx internal RC oscillator (HSI) calibration” available from the
3. Guaranteed by design, not tested in production.
4. Based on characterization, not tested in production.
Low-speed internal (LSI) RC oscillator
Table 25.
1. V
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Wakeup time from low-power mode
The wakeup times given in
oscillator. The clock source used to wake up the device depends from the current operating
mode:
●
●
I
t
DD(HSI)
Symbol
ACC
su(HSI)
I
ST website www.st.com.
t
Symbol
DD(LSI)
f
su(LSI)
DD
DD
HSI
f
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
LSI
HSI
= 3.3 V, T
= 3 V, T
(4)
(2)
(4)
(3)
(3)
Frequency
Accuracy of the HSI
oscillator
HSI oscillator
startup time
HSI oscillator
power consumption
HSI oscillator characteristics
LSI oscillator characteristics
A
A
= –40 to 105 °C unless otherwise specified.
Frequency
LSI oscillator startup time
LSI oscillator power consumption
Parameter
= –40 to 105 °C unless otherwise specified.
DD
supply voltage conditions summarized in
Table 24
Table 26
Parameter
Doc ID 15274 Rev 5
User-trimmed with the RCC_CR
register
Factory-
calibrated
are derived from tests performed under ambient
is measured on a wakeup phase with a 8-MHz HSI RC
(2)
(4)
Conditions
(1)
(1)
T
T
T
T
A
A
A
A
= –40 to 105 °C
= –10 to 85 °C
= 0 to 70 °C
= 25 °C
Min
30
Table
Electrical characteristics
–1.5
–1.3
–1.1
Min
–2
1
0.65
Typ
40
9.
Typ
80
8
Max
1.2
60
85
Max
100
1
2.5
2.2
1.8
2
2
(3)
Unit
kHz
49/101
MHz
µA
Unit
µs
µA
µs
%
%
%
%
%