ST10F276-6Q3 STMicroelectronics, ST10F276-6Q3 Datasheet - Page 113
ST10F276-6Q3
Manufacturer Part Number
ST10F276-6Q3
Description
MCU 16BIT 832K FLASH 144-PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet
1.ST10F276-4TR3.pdf
(231 pages)
Specifications of ST10F276-6Q3
Core Processor
ST10
Core Size
16-Bit
Speed
64MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-MQFP, 144-PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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ST10F276E
4. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
Figure 29. Synchronous short / long hardware RESET (EA = 0)
1. RSTIN assertion can be released there. Refer also to
2. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
3. 3 to 8 TCL depending on clock source selection.
4. RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit
5. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
BDRSTEN is cleared after reset.
by the internal filter (refer to
5V operation), the asynchronous reset is then immediately entered.
BDRSTEN is cleared after reset.
by the internal filter (refer to
RSTIN
RSTF
(After Filter)
P0[15:13]
P0[12:2]
P0[1:0]
ALE
RST
RSTOUT
RPD
≤ 500 ns
≥ 50 ns
≤4 TCL
200mA Discharge
5)
1)
≤12 TCL
not t.
Section
Section
≤ 500 ns
≥ 50 ns
19.1).
19.1).
4)
< 1032 TCL
1024 TCL
not transparent
not transparent
transparent
Section 19.1
≤ 500 ns
≥ 50 ns
8 TCL
2)
At this time RSTF is sampled HIGH or LOW
so it is SHORT or LONG reset
V
3..8 TCL
RPD
for details on minimum pulse duration.
> 2.5V Asynchronous Reset not entered
3)
not t.
not t.
8 TCL
System reset
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