ST10F276-6Q3 STMicroelectronics, ST10F276-6Q3 Datasheet - Page 176
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ST10F276-6Q3
Manufacturer Part Number
ST10F276-6Q3
Description
MCU 16BIT 832K FLASH 144-PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet
1.ST10F276-4TR3.pdf
(231 pages)
Specifications of ST10F276-6Q3
Core Processor
ST10
Core Size
16-Bit
Speed
64MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-MQFP, 144-PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Electrical characteristics
23.3
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2. For details on operating conditions concerning the usage of A/D converter, refer to
Power considerations
The average chip-junction temperature, T
following equation:
Where:
T
Θ
P
P
P
Most often in applications, P
be significant if the device is configured to continuously drive external modules and/or
memories.
An approximate relationship between P
Therefore (solving equations 1 and 2):
Where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
are obtained by solving equations (1) and (2) iteratively for any value of T
Table 88.
Based on thermal characteristics of the package and with reference to the power
consumption figures provided in the next tables and diagrams, the following product
classification can be proposed. In any case, the exact power consumption of the device
inside the application must be computed according to different working conditions, thermal
profiles, real thermal resistance of the system (including printed circuit board or other
substrata) and I/O activity.
A
D
INT
I/O
JA
Symbol
is the Ambient Temperature in °C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
represents the Power Dissipation on Input and Output Pins; user determined.
Θ
is the product of I
JA
D
Thermal characteristics
Thermal resistance junction-ambient
PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch
LQFP 144 - 20 x 20 x 1.40 mm
(at equilibrium) for a known T
INT
and P
DD
and V
K = P
I/O
I/O
(P
< P
DD
D
Description
D
P
T
x (T
, expressed in Watt. This is the Chip Internal Power,
INT
D
J
= P
= K / (T
= T
, which may be ignored. On the other hand, P
A
INT
+ 273°C) + Θ
D
A
and T
J
+ (P
+ P
, in degrees Celsius, is calculated using the
A.
J
+ 273°C) (2)
I/O
D
Using this value of K, the values of P
J
x Θ
),
(if P
JA
JA
I/O
) 1)
x P
is neglected) is given by:
D
2
(3)
Value (typical)
Section
30
35
A
.
23.7.
ST10F276E
D
I/O
°C/W
Unit
and T
may
J
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