MC908GR4CDWE Freescale Semiconductor, MC908GR4CDWE Datasheet - Page 13

• Manufacturer Part Number: MC908GR4CDWE
• Description: IC MCU 4K FLASH 8MHZ 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908GR4CDWE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number Of I /o: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: HC08
• No. Of I/o's: 21
• Ram Memory Size: 384Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08GR
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8.2 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908GZ60E, M68CBL05CE, M68EML08GPGTE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

MC68HC908GR8 — Rev 4.0
MOTOROLA
16.7
17.1
17.2
17.3
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
Freescale Semiconductor, Inc.
Section 18. Serial Communications Interface (SCI)
For More Information On This Product,
Port E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Pin Name Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .250
SCI During Break Module Interrupts. . . . . . . . . . . . . . . . . . . . 251
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
I/O Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
SIM Bus Clock Control and Generation . . . . . . . . . . . . . . . . . 275
Reset and System Initialization. . . . . . . . . . . . . . . . . . . . . . . . 276
SIM Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281
Exception Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .290
SIM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293
Section 19. System Integration Module (SIM)
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Table of Contents
Section 17. RAM
Table of Contents
Technical Data
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